New cooperation model for software-defined cars: CARIAD, the software unit of Volkswagen Group, and STMicroelectronics (ST), a global semiconductor provider serving customers across the spectrum of electronics applications, will shortly launch the joint development of an automotive system-on-chip (SoC). Together, CARIAD and ST are developing tailored hardware for connectivity, energy management, and over-the-air updates — making…
Renesas and Cyberon to deliver integrated voice-user interface solutions
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Cyberon Corporation, an embedded speech solution provider, announced that they have partnered to deliver voice user interface (VUI) solutions for customers using Renesas’ entire RA MCU line. Renesas RA customers will now have complimentary access to Cyberon’s continuous command-based VUI toolchain, enabling them to add…
STMicroelectronics releases Bluetooth SoC with location tracking
STMicroelectronics has introduced its third-generation Bluetooth System-on-Chip (SoC), enhanced with Bluetooth direction-finding technology for location-tracking and real-time positioning applications. By determining the direction of a Bluetooth Low Energy (BLE) signal, the Bluetooth 5.3 certified BlueNRG-LPS SoC can precisely estimate movement and location with centimetre accuracy. It uses Bluetooth-specified technology including angle-of-arrival (AoA) and angle-of-departure (AoD), as…
MediaTek’s chipset offers high-performance option for 5G smartphones
MediaTek has announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm…
TI breaks ground on 300-mm semiconductor wafer-fabrication plants in Texas
Texas Instruments (TI) has officially broken ground on its new 300-mm semiconductor wafer-fabrication plants (or “fabs”) in Sherman, Texas. In a groundbreaking ceremony attended by elected officials and community leaders, TI Chairman, President and CEO Rich Templeton celebrated the start of construction on the largest private-sector economic investment in Texas history and reiterated the company’s commitment to expanding…
Infineon offers Press Pack IGBT for transmission and distribution applications
Infineon Technologies Bipolar GmbH & Co. KG has expanded its high-power Prime Switch family with the new Press Pack IGBT (PPI) with internal freewheeling diodes (FWD) in ceramic disc housings. This PPI is specifically designed for transmission and distribution applications and is ideal for high-current Modular Multilevel Converter (MMC), medium-voltage drives, DC breakers, wind-turbine converters,…
STMicroelectronics and MACOM announce successful RF GaN-on-Si prototypes
STMicroelectronics, a global semiconductor provider, and MACOM Technology Solutions Holdings, a supplier of semiconductor products for the telecommunications, industrial, defense, and datacenter industries, have announced the successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes. With this achievement, ST and MACOM will continue to work together and enhance our relationship. RF GaN-on-Silicon offers high potential for…
STMicroelectronics launches new MDmesh MOSFETs
STMicroelectronics’ STPOWER MDmesh M9 and DM9 N-channel super-junction, multi-drain, silicon-power MOSFETs are ideal for switched-mode power supplies (SMPS) in applications from data-center servers and 5G infrastructure to flat-panel televisions. The first devices to be launched are the 650V STP65N045M9 and the 600V STP60N043DM9. Both have low on-resistance (RDS(on)) per unit area, which maximizes power density and permits compact system dimensions. Each has…
Infineon releases new family of CoolSiC 650V silicon-carbide MOSFETs
Megatrends including digitalization, urbanization, and electromobility all equate to an increase in power consumption. At the same time, energy efficiency is more important than ever. Infineon Technologies is responding to these megatrends and related demands by offering a new family of CoolSiC 650 V silicon-carbide (SiC) MOSFETs to deliver reliable, easy-to-use, and cost-effective top performance.…
Vishay’s new power MOSFETs offer high efficiency for datacenter applications
Vishay Intertechnology has introduced the latest device in its fourth-generation 600 V E Series power MOSFETs. Providing high efficiency for telecom, server, and datacenter power-supply applications, the Vishay Siliconix n-channel SiHK045N60E slashes on-resistance by 27 percent compared with previous-generation 600 V E Series MOSFETs — while delivering 60 percent lower gate charge. This results in…
New Vishay IR emitters deliver 30% higher radiant intensity
Vishay Intertechnology is broadening its optoelectronics portfolio with the release of six new 850 and 940 nm high-power infrared (IR) emitters that deliver best-in-class radiant intensity in 3.4 by 3.4 mm surface-mount packages. Built on Vishay’s SurfLight surface emitter chip technology, the Vishay Semiconductors devices are designed for high drive-currents up to 1.5 A DC…
Samsung launches smart, fingerprint security IC for biometric payment cards
Samsung Electronics, a provider of advanced semiconductor technology, has introduced its new fingerprint security IC (integrated circuit) ─ S3B512C ─ with enhanced security features. The new solution is EMVCo and Common Criteria Evaluation Assurance Level (CC EAL) 6+ certified and performs in line with Mastercard’s latest Biometric Evaluation Plan Summary (BEPS) specifications for biometric payment…
Vishay offers two new n-channel MOSFETs that increase power density
Vishay Intertechnology, Inc. has introduced two new n-channel TrenchFET MOSFETs that increase power density, efficiency, and board-level reliability in telecom and industrial applications. To achieve these design goals, the 60 V SiJH600E and 80 V SiJH800E combine ultra low on-resistance with high-temperature operation to +175° C and high continuous drain-current handling. The space-saving PowerPAK 8x8L package promotes board-level…
Vishay enchances its series of automotive-grade, thin-film chip resistors
Vishay Intertechnology announced that the company has enhanced its MC AT precision series of automotive-grade, thin-film chip resistors with a wider range of resistance values in the 0402, 0603, and 0805 case sizes. The Vishay Beyschlag devices combine their high resistance values with TCR of ± 25 ppm/K, tight tolerances of ± 0.1 %, and…
Toshiba releases new photorelays ideal for smart meters
Toshiba Electronic Devices & Storage Corporation has launched two new photorelays, “TLP223GA” and “TLP223J,” with an OFF-state output terminal-voltage rating of 400V and 600V, respectively. They both feature low input power, improved switching characteristics, and are housed in a DIP4 package. The new products come with a highly luminous efficiency LED developed and have a…
Infineon launches new generation of single half-bridge ICs
Infineon Technologies presents the new MOTIX BTN99xx (NovalithIC+), a unique family of intelligent integrated half-bridges and the direct successor to the BTN89xx. Besides a p-channel high-side and an n-channel low-side MOSFET, BTN99xx also includes smart driver ICs fully integrated in a single package. Its ease-of-use, offering advanced protection and scalability, which makes the family ideal…
New OptiMOS power MOSFET package enables innovative source-down technology
High-power density, optimized performance, and ease-of-use are key requirements when designing modern power systems. To offer practical solutions for design challenges in end applications, Infineon Technologies has launched a new generation of OptiMOS source-down (SD) power MOSFETs. These devices come in a PQFN 3.3 x 3.3 mm2 package and a wide voltage class ranging from…
Toshiba’s voltage-driven photorelays offer one of industry’s smallest mounting areas
Toshiba Electronic Devices & Storage Corporation has launched three 4-Form-A, voltage-driven photorelays, “TLP3407SRA4,” “TLP3412SRHA4,” and “TLP3475SRHA4,” that have one of the smallest mounting areas in the industry. Volume shipments start today. The new products are Toshiba’s first-ever four-circuit, 4-Form-A relays. Housed in a newly-developed small S-VSON16T package, they feature a typical mounting area of 12.5mm2,…
New, high-performing Mobileye EyeQ Ultra enables autonomous vehicles
Mobileye has introduced the EyeQ Ultra, the company’s most advanced and highest-performing system-on-chip (SoC) purpose-built for autonomous driving. As unveiled during CES 2022, the EyeQ Ultra maximizes effectiveness and efficiency at only 176 TOPS, currently making it the industry’s leanest autonomous vehicle (AV) chip. This efficiently designed SoC builds on seven generations of proven EyeQ…
STMicroelectronics and Politecnico di Milano expand semiconductor R&D capabilities at PoliFab
STMicroelectronics and Politecnico di Milano (PoLiMi) have inaugurated the expansion of semiconductor-manufacturing capabilities at PoliFab, the University’s micro and nanotechnology R&D center. Building on the long-standing collaboration between the two organizations, the PoliFab’s clean room — a facility where silicon wafers are made into semiconductor chips — has received state-of-the-art equipment from STMicroelectronics to boost…