Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced the development of two technologies that reduce the energy and voltage application time for the write operation of spin-transfer torquemram magnetic random-access memory (STT-MRAM, hereinafter MRAM). On a 20-megabit (Mbit) test chip with embedded MRAM memory cell array in a 16 nm FinFET logic…
STMicroelectronics releases new silicon-carbide devices for EVs
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, is introducing its third generation of STPOWER silicon-carbide (SiC) MOSFETs. ST’s new SiC devices are advancing the state-of-the-art in power devices for electric-vehicle (EV) powertrains and other applications where power density, energy efficiency, and reliability are important target criteria. ST has incorporated…
Renesas introduces RA6T2 MCUs for next-generation motor control
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has launched the RA6T2 Group MCUs, which feature a rich set of peripheral functions and hardware accelerator designed specifically for motor control. The new RA6T2 Group MCUs deliver a combination of performance, features, and cost-efficiency for motor control designs in home appliances, smart home, industrial and…
Toshiba releases high-peak output current photocouplers
Toshiba Electronic Devices & Storage Corporation has introduced two photocouplers, “TLP5705H” and “TLP5702H,” housed in a thin SO6L package, for use as insulated gate drivers for small to medium-capacity IGBTs/MOSFETs. Volume shipments have already begun. TLP5705H is Toshiba’s first product to deliver a peak output current rating of ±5.0A in a thin package (SO6L) of only…
Micron and MediaTek first to validate LPDDR5X 5G chipset for smartphone
MediaTek recently validated Micron Technology’s low-power, double data rate 5X (LPDDR5X) DRAM for MediaTek’s new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this fastest, most advanced mobile memory in the industry and has shipped the first batch of samples of LPDDR5X built on its first-to-market…
Texas Instruments to construct 300-mm semiconductor wafer fabrication plants
Texas Instruments (TI) has announced plans to begin construction next year on its new 300-millimeter semiconductor wafer fabrication plants (or “fabs”) in Sherman, Texas. The North Texas site has the potential for up to four fabs to meet demand over time, as semiconductor growth in electronics, particularly in industrial and automotive markets, is expected to continue well…
Nexperia offers range of A-selection Zener diodes for precise voltage
Nexperia, the expert in essential semiconductors, has announced the industry’s first range of A-selection Zener diodes. With a tolerance of just ±1%, the BZT52H-A (SOD123F) and BZX384-A (SOD323) series provide a higher precision voltage reference compared to the B (±2%) and C (±5%) variants. Matching the rising demands of mobile, portable/wearable, automotive and industrial applications…
Renesas unveils ultra-low-power ForgeFPGA Family with software
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, recently announced that it’s entering the field-programmable gate array (FPGA) market with a new line of low-cost, low-power devices. The ForgeFPGA Family will address the underserved market need for relatively small amounts of programmable logic that can be quickly and efficiently designed into cost-sensitive applications. The…
Nexperia launches A-selection Zener diodes with industry’s lowest tolerance of ±1%
Nexperia, an expert in essential semiconductors, announced the industry’s first range of A-selection Zener diodes. With a tolerance of just ±1%, the BZT52H-A (SOD123F) and BZX384-A (SOD323) series provide a higher precision-voltage reference compared to the B (±2%) and C (±5%) variants. Matching the rising demands of mobile, portable/wearable, automotive and industrial applications and meeting…
STMicroelectronics launches NFC Type 2 Tag IC with privacy features
STMicroelectronics’ ST25TN512 and ST25TN01K NFC Forum Type 2 tag ICs deliver a new balance of cost and performance for high-volume use cases like consumer engagement, product information, and brand protection. Also suitable for smart-city applications and access control, the ST25TN512/01K NFC tag ICs support multiple user-protection and privacy mechanisms including a seven-byte unique chip-identifier code, TruST25 digital signature, NFC…
Vishay’s new high-voltage chip divider improves TC tracking performance
Vishay Intertechnology has introduced the industry’s first high-voltage chip divider to be offered in a ribbed, molded package with compliant surface-mount leads. Designed to reduce component counts and improve TC tracking performance and ratio stability in automotive and industrial equipment, the Vishay Techno CDMM delivers a maximum working voltage of 1500 V in the 4527 case…
New Qualcomm report calls for accelerated 5G technology and adoption
A new Qualcomm Technologies report, “Environmental sustainability and a greener economy: The transformative role of 5G,” highlights the many ways 5G technology can achieve critically needed sustainability benefits and calls for joint efforts by industry and government to accelerate 5G adoption. The report finds that 5G can transform and positively impact industries across the globe…
Microchip launches fully configurable, digital gate driver for silicon-carbide MOSFETs
As demand for electric buses and other electrified heavy transport vehicles increases to meet lower emission targets, silicon carbide-based power management solutions are providing greater efficiencies in these transportation systems. To complement its broad portfolio of silicon carbide MOSFET discrete and module products, Microchip Technology has announced a new 1200V production-ready digital gate driver —…
Nexperia surface-mount device passes Board Level Reliability for automotive applications
Nexperia, a semiconductor provider, announced that one of its surface-mount device packages — the clip-bond FlatPower package CFP15B — has passed Board-level Reliability (BLR) testing for automotive applications by a top Tier 1 supplier. Initially, the FlatPower package will be used in an engine-control unit. BLR provides a means of evaluating the reliability of semiconductor…
Samsung earns global carbon-footprint certification for its logic chips
Samsung Electronics, a provider of advanced semiconductor technology, announced that four of its System LSI products received product carbon-footprint label certification from the Carbon Trust — the first of Samsung’s logic chips to do so. Having received the semiconductor industry’s first carbon-footprint accreditation for memory chips from the Carbon Trust in 2019, Samsung has now…
STMicroelectronics launches new MasterGaN integrated power packages
Easing the transition to high-efficiency wide-bandgap technology, STMicroelectronics has released the MasterGaN3* and MasterGaN5 integrated power packages for applications up to 45 and 150W. Joining the MasterGaN1, MasterGaN2, and MasterGaN4 — which target applications from 65 to 400W — the additions give extra flexibility to choose the optimum Gallium Nitride (GaN) device and driver solution when designing switched-mode power…
STMicroelectronics extends silicon-carbide wafer supply agreement with Cree
Cree, Inc., the global provider in silicon-carbide technology through its Wolfspeed business, and STMicroelectronics, a global semiconductor provider, announced the expansion of an existing multi-year, long-term silicon-carbide wafer supply agreement. The amended agreement, which calls for Cree to supply ST with 150mm silicon-carbide bare and epitaxial wafers over the next several years, is now worth…
ROHM’s EMARMOUR op-amp series achieves noise immunity
ROHM developed the BD8758xY series (BD87581YG-C, BD87582YFVM-C) of rail-to-rail input/output, high-speed CMOS op amps that feature improved EMI immunity for automotive and industrial equipment applications. The series is ideal for applications that require high-speed sensing in harsh environments, such as vehicle engine control units and anomaly detection systems for factory automation equipment. In recent years, advancements…
Infineon and Bosch launch ultra-low loss diode for light vehicle generators
Infineon Technologies and Robert Bosch GmbH are launching a new ultra-low-loss diode: the Active Rectifying Diode for light vehicle generators. It enables an increase in generator efficiency of up to eight percent compared to conventional power conversion methods and facilitates generators to qualify as eco-innovations as defined by the European Union. Deploying the new diode…
Microchip offers 1700V silicon-carbide power solutions
Today’s energy-efficient electric charging systems powering commercial vehicle propulsion — as well as auxiliary power systems, solar inverters, solid-state transformers, and other transportation and industrial applications — all rely on high-voltage switching power devices. To best meet these requirements, Microchip Technology announced the expansion of its silicon-carbide portfolio with a family of high-efficiency, high-reliability 1700V…