Infineon Technologies has introduced a new CoolSiC technology to its lineup: the CoolSiC MOSFET 1200 V M1H. This advanced silicon-carbide (SiC) chip will be implemented in a widely extended portfolio using the popular Easy Module family — with discrete packages using .XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar…
Nexperia launches enhanced electrothermal models for its MOSFET devices
Nexperia, an expert in essential semiconductors, has released new, enhanced electrothermal models for its MOSFET devices. Semiconductor manufacturers commonly provide simulation models for their MOSFETs. But these typically only include a limited number of device parameters that have been modeled at typical operating temperatures. Nexperia’s new advanced models capture the thermal interdependency of the complete…
Microchip unveils industry’s lowest on-resistance 3.3 kV silicon-carbide power devices
System designers of traction power units (TPUs), auxiliary power units (APUs), solid-state transformers (SSTs), industrial motor drives, and energy infrastructure solutions require high-voltage switching technology to increase efficiency, reduce system size and weight. Microchip Technology has announced the expansion of its SiC portfolio with the release of the industry’s lowest on-resistance [RDS(on)] 3.3 kV SiC…
Next-generation EiceDRIVER 2EDN gate driver ICs set new benchmark for form factor
Infineon Technologies is releasing a new EiceDRIVER 2EDN product family. Aiming at space-limited designs, the next-generation devices complement the existing 2EDN driver ICs by providing higher system-level efficiencies, excellent power density, and consistent system robustness with fewer external components. Building on this expansion, the 2EDN family can now drive the power-switch device performance in applications…
Infineon’s OptiMOS 5 25 and 30 V offer performance in a small form factor
Committed to setting new technology standards in discrete power-MOSFET technologies, Infineon Technologies is introducing its new PQFN 2 x 2 mm2 OptiMOS 5 25 V and 30 V product family. By combining thin wafer technology and packaging innovation, the new devices enable significant performance benefits in an extremely small form factor. OptiMOS 5 25 V…
EIB supporting STMicroelectronics’ semiconductor R&D activities
The European Investment Bank (EIB) is providing significant financial support to STMicroelectronics: a €600 million loan for the semiconductor group’s research and development (R&D) and pre-industrialisation activities in Europe. The operation concerns investments in R&D activities for innovative technologies and components, as well as in pilot production lines for advanced semiconductors. These investments will be implemented…
Infineon introduces MERUS Class D, an audio amplifier multichip module
Unlocking the potential of its best-in-class power MOSFET technology, Infineon Technologies is introducing the MERUS 2-channel, analog input, class D audio amplifier multichip module (MCM) MA5332MS. Class D audio power amplifiers offer a combination of small size, low heat dissipation, high integration, and excellent sound quality. The new module is a powerful upgrade to its predecessor,…
Vishay offers automotive-grade, silicon PIN photodiode in surface-mount package
The Optoelectronics group of Vishay Intertechnology has introduced a new automotive-grade, 4-quadrant silicon PIN photodiode in a standard surface-mount package. Enabling a variety of sensor and control applications for the automotive, consumer, and industrial markets, the Vishay Semiconductors K857PH combines high photo sensitivity with low 0.1 % crosstalk and virtually no tolerance between its segments. The…
Renesas hits milestone orders for its RX family of 32-bit microcontrollers
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that it has delivered more than one-billion microcontrollers from its RX Family of 32-bit MCUs, which incorporate Renesas’ proprietary RX CPU core. Since its launch in 2009, the RX Family has expanded to include general-purpose, motor control, touch sensing, and industrial Ethernet applications — and…
Samsung unveils advanced automotive-memory solutions for EVs
Samsung Electronics, a global provider in advanced memory technology, has unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous electric vehicles (EVs). The new lineup includes a 256-gigabyte (GB) PCIe Gen3 NVMe ball grid array (BGA) SSD, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for high-performance infotainment systems, as well as…
STMicroelectronics offering new family of GaN power semiconductors
STMicroelectronics, a global semiconductor serving customers across the spectrum of electronics applications, has revealed a new family of GaN power semiconductors in the STPOWER portfolio that can significantly reduce energy use and enable slimmer designs in a variety of electronic products. Target applications include consumer equipment such as chargers, external power adapters for PCs, LED-lighting…
Diodes’ advanced charger solution earns EE Award
Diodes Incorporated has announced that its ultra-high-power-density (UHPD) charger solution has won an award in the featured, “Energy-Saving Power Semiconductor Provider” category at the inaugural EE Awards Asia. The three-chip charger solution was originally developed to enhance performance in applications, such as notebook computer adapters and smartphone chargers. The EE Awards Asia celebrates the achievements…
Renesas releases its first dual-beam, active beamforming IC lineup
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs: F6121 for Ku-band Satcom F6122 for Ka-band Satcom and F6123 for Ku-band radar and line-of-sight communications Featuring best-in-class power consumption, noise figure, a compact size, and…
Nexperia to produce MOSFETs using its innovative NextPower silicon technology
Nexperia, an expert in essential semiconductors, announced that the first products to be made in the company’s new eight-inch wafer line in Manchester, UK, will be low RDS(on), low Qrr 80 V and 100 V MOSFETs — using its latest NextPower silicon technology. The new production line expands Nexperia’s capacity. Plus, the new PSMN3R9-100YSF (100…