TSMC recently announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness — with a full…

The new dimension of digitalization is enormous and global data volumes will only multiply exponentially in the future with video streaming, virtual conferences, cloud services, cryptocurrencies, and many other digital applications. Experts estimate a 146-fold increase in data in just 15 years. According to the U.S. International Trade Commission, 175 zettabytes (≙ 175,000,000,000,000,000,000,000 bytes) of…

Nexperia, an expert in essential semiconductors, announced the latest additions to its rapidly expanding portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include 32 planar Schottky diodes and eight hyperfast recovery rectifiers housed in the CFP15B package. They’re available as standard and Q-types that meet AEC-Q101 automotive qualification…

Very-large-scale integration or VLSI chips integrate several high-level components, which are highly sophisticated gate-level circuits. Semiconductor Intellectual Property (IP) is the standard source for synthesizing higher-level components in VLSI chips or FPGA boards. Semiconductor IPs typically provide the hardwired, implementable design of one of the following:  A transform  An encryption or deciphering algorithm The adaptive…

Optimized performance, efficiency, and reliability in high-voltage power supplies need to be combined with reduced bill-of-material (BOM) count and cost, as well as lower design efforts. With its 5th generation fixed-frequency (FF) CoolSET portfolio, Infineon Technologies offers the ideal components to meet these needs and effectively manage the critical design trade-offs. The new 800 and 950 V AC-DC…

Vishay Intertechnology has introduced 15 new FRED Pt Gen 5 600 V and 1200 V Hyperfast and Ultrafast rectifiers in the compact SOT-227 package. Offering the best conduction and switching loss trade-off for devices in their class, the Vishay Semiconductors rectifiers are designed to increase the efficiency of high-frequency converters and of soft-switched or resonant designs.…

Vishay Intertechnology has introduced two new UVC (short wavelength ultraviolet) emitting diodes in a ceramic and quartz-based package for sterilization in medical, industrial, and consumer applications. Compared to previous-generation solutions, the Vishay Semiconductors VLMU35CR40-275-120 and VLMU35CR41-275-120 deliver higher radiant power at a lower cost, while offering higher disinfection efficiency and longer service life. The new…

STMicroelectronics has released two STPOWER modules that contain 1200V silicon-carbide (SiC) MOSFETs in popular configurations. Each uses ST’s ACEPACK 2 package technology to ensure high power density and simplified assembly. The first of the new modules, the A2F12M12W2-F1, is a four-pack module that provides a convenient and compact full-bridge solution for circuits such as DC/DC converters. Another module,…

Vishay Intertechnology has introduced four new FRED Pt Gen 5 600 V Ultrafast rectifiers in the TO-244 package. Offering the ideal conduction and switching loss trade-off for devices in their class, the 240 A, 300 A, 480 A, and 600 A Vishay Semiconductors rectifiers are designed to increase the efficiency of medium frequency power converters…

According to The World Semiconductor Trade Statistics (WSTS) — a non-profit organization of semiconductor product companies and source for industry statistics — the electronic design automation (EDA) market was valued at $11.57 billion in 2020 and is expected to reach $21.36 billion by 2026. EDA refers to using computer-aided tools and services for the design,…

Nexperia, an expert in essential semiconductors, announced the release of a new range of 20 and 30V MOSFETs in the world’s smallest DFN package — the DFN0603. The company already offers ESD protection devices in this package, but has now succeeded in bringing it to their MOSFET portfolio, a feat as yet unmatched in the…

Global megatrends such as digitalization, and decarbonization, call for wide bandgap (WBG) devices (SiC/GaN). Due to their unique technological characteristics, they enable the highest performance and energy efficiency. With a commitment to these domains, Infineon Technologies and Delta Electronics, Inc., are deepening their collaboration to deliver superior solutions for the convenience of end customers. The…

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, and GlobalFoundries Inc., a feature-rich semiconductor manufacturing, today announced they have signed a Memorandum of Understanding to create a new, jointly operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a strategic partnership with Tata Motors Ltd. (TML) and Tejas Networks Ltd., Tata Group companies, on the design, development, and manufacturing of Renesas’ semiconductor solutions for enhancing innovation across electronics systems for the Indian and emerging markets. “We see great potential in collaborating with…

Nexperia, an expert in essential semiconductors, announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next-generation, low-voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards. As processor geometries advance to single-digit nanometer nodes, the core voltage of advanced SoCs is…

STMicroelectronics’ ST25R3916B-AQWT and ST25R3917B-AQWT NFC Forum Reader devices combine high output power and energy efficiency at a competitive price. Supporting NFC initiator, target, reader, and card-emulation modes, they can be used in contactless-payment, device pairing, wireless charging, brand protection, and other industrial and consumer applications. The new devices introduce improved active wave shaping (AWS) with increased flexibility that…

Infineon Technologies has introduced a new CoolSiC technology to its lineup: the CoolSiC MOSFET 1200 V M1H. This advanced silicon-carbide (SiC) chip will be implemented in a widely extended portfolio using the popular Easy Module family — with discrete packages using .XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar…

Nexperia, an expert in essential semiconductors, has released new, enhanced electrothermal models for its MOSFET devices. Semiconductor manufacturers commonly provide simulation models for their MOSFETs. But these typically only include a limited number of device parameters that have been modeled at typical operating temperatures. Nexperia’s new advanced models capture the thermal interdependency of the complete…

System designers of traction power units (TPUs), auxiliary power units (APUs), solid-state transformers (SSTs), industrial motor drives, and energy infrastructure solutions require high-voltage switching technology to increase efficiency, reduce system size and weight. Microchip Technology has announced the expansion of its SiC portfolio with the release of the industry’s lowest on-resistance [RDS(on)] 3.3 kV SiC…

Infineon Technologies is releasing a new EiceDRIVER 2EDN product family. Aiming at space-limited designs, the next-generation devices complement the existing 2EDN driver ICs by providing higher system-level efficiencies, excellent power density, and consistent system robustness with fewer external components. Building on this expansion, the 2EDN family can now drive the power-switch device performance in applications…