At CES 2023 in Las Vegas, Rohde & Schwarz will present the R&S ATS1500C radar test chamber — a complete test solution for interference and RF performance testing of automotive radar sensors, the primary technology that enables autonomous driving. Another highlight will be an ultra-wideband (UWB) testing solution for smartphone and automotive applications using the…
STMicroelectronics’ managing control and security of the Google Pixel 7
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has revealed that its ST54K IC is handling control and security for contactless NFC communication in the newly launched Google Pixel 7 smartphone. Chosen by Google’s designers, ST’s device combines NFC control and a certified Secure Element in a single chip that saves…
Snapdragon 8+ Gen 1 now powers Samsung Galaxy Z devices
Qualcomm Technologies, Inc. announced that its flagship Snapdragon 8+ Gen 1 Mobile Platform is powering Samsung Electronics’ latest foldable smartphones, the Samsung Galaxy Z Fold4 and Galaxy Z Flip4. The company’s newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering performance enhancements for a boost across all on-device experiences. The new Galaxy Z series…
MediaTek’s chipset offers high-performance option for 5G smartphones
MediaTek has announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm…
MediaTek launches Dimensity 8000 5G chip series for 5G smartphones
MediaTek has launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology — connectivity, displays, gaming, as well as multimedia and imaging features — to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek’s powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which…
Qualcomm and its partners offer first smartphone demo of iSIM technology
Qualcomm Technologies, Vodafone, and Thales have joined forces to demonstrate a working smartphone, featuring iSIM (based on the ieUICC GSMA specification), a new technology enabling the functionality of a SIM card to be integrated into a device’s main processor. This milestone paves the way for commercialization of the technology, which could be rolled out in…
Diodes’ advanced charger solution earns EE Award
Diodes Incorporated has announced that its ultra-high-power-density (UHPD) charger solution has won an award in the featured, “Energy-Saving Power Semiconductor Provider” category at the inaugural EE Awards Asia. The three-chip charger solution was originally developed to enhance performance in applications, such as notebook computer adapters and smartphone chargers. The EE Awards Asia celebrates the achievements…
Snapdragon 888 to power new Samsung Galaxy Z Fold3 & Galaxy Z Flip3
Qualcomm Technologies announced that its flagship Snapdragon 888 5G Mobile Platform is powering Samsung Electronics‘ latest foldable smartphones — the Samsung Galaxy Z Fold3 and Galaxy Z Flip3. Snapdragon 888, which powers both devices globally, packs innovations in connectivity, AI, gaming, and photography to enable the premium Android experiences users deserve. “Our collaboration with Qualcomm…
STMicroelectronics launches multi-purpose NFC transceiver
The ST25R3918 from STMicroelectronics is a multi-purpose NFC transceiver, supporting passive peer-to-peer functionality, NFC card-emulation mode, and NFC reader operation. Delivering most of the functionality of the flagship ST25R3916 NFC reader at a competitive price, the ST25R3918 enables use cases such as accessory identification for a wide range of applications — including power tools and personal healthcare…