Edge AI refers to deploying artificial intelligence (AI) algorithms and models directly on local devices like sensors, smartphones, or Internet-of-Things (IoT) devices. This approach includes edge computing, which processes data closer to where it’s generated rather than sending it to a centralized Cloud for analysis. According to a report by Gartner, by the end of…
Microchip adds to its mid-range FPGA and SoC support
Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are twin priorities, and the need for cradle-to-grave security continues to grow. Satisfying these simultaneous demands requires immediate knowledge of special technology and vertical-market expertise. There’s no…
MediaTek develops first chip using TSMC’s 3nm process
MediaTek announced that it has successfully developed its first chip using TSMC’s 3nm technology — taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC. Both companies are taking advantage of their chip design and manufacturing strengths to…
Infineon launches XENSIV radar sensor for healthcare and consumer electronics
Infineon Technologies introduces the new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it’s the smallest 60 GHz radar sensor with antennas in package (AIP) on the market and is specifically designed for integration into the smallest devices. This makes the sensor ideal for vital sensing (heart and respiratory…
Intel and Ericsson partner to advance next-gen optimized 5G infrastructure
Intel announced a strategic collaboration agreement with Ericsson to use Intel’s 18A process and manufacturing technology for Ericsson’s future next-generation optimized 5G infrastructure. As part of the agreement, Intel will manufacture custom 5G SoCs (system-on-chip) for Ericsson to create highly differentiated leadership products for future 5G infrastructure. Additionally, the companies will expand their collaboration to…
Renesas develops space-ready reference design for AMD Versal adaptive SoC
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a complete space-ready reference design for the AMD Versal adaptive system-on-chip (SoC) XQRVC1902. Developed in collaboration with AMD, the ISLVERSALDEMO2Z reference design integrates key radiation-hardened components for power management, including four new and recently released products in an ultra-compact design. These Intersil-brand ICs are specifically…
Renesas automotive cybersecurity management ISO/SAE certified
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that its automotive Cyber Security Management System (CSMS) used for the development of microcontrollers (MCU) and system on chips (SoCs) has been defined and implemented according to International Standard ISO/SAE 21434:2021. The CSMS framework applies to Renesas’ design center in Musashi, Japan and has been…
Renesas introduces R-Car S4 Starter Kit for automotive systems
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a new development board for automotive gateway systems. The R-Car S4 Starter Kit is a low-cost, readily available development board for building software using the Renesas R-Car S4 system-on-chip (SoC). The SoC delivers high computing performance and an array of communication features for both cloud communication…
TSMC opens Advanced Backend Fab 6
TSMC recently announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) process technology. Advanced Backend Fab 6 enables TSMC to…
New Microsoft MPLAB SiC Power Simulator evaluates SiC power devices
The electrification of everything is driving the growth of SiC semiconductors as large market segments such as E-Mobility, sustainability and industrial turn to SiC power solutions because of its fast-switching capabilities, lower power loss, and higher-temperature performance. To help power design engineers transition to SiC power solutions with ease, speed and confidence, Microchip Technology announces…
Infineon’s AIROC system on chip released with Bluetooth 5.4 specification
Infineon Technologies announced its AIROC CYW20829 Bluetooth LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth…
STMicroelectronics offers new range of single-chip antenna-matching ICs
STMicroelectronics has extended its range of single-chip antenna-matching ICs that simplify RF-circuit design with two new devices optimized for BlueNRG-LPS system-on-chip ICs (SoCs) and STM32WB1x and STM32WB5x wireless microcontrollers. The MLPF-NRG-01D3 for BlueNRG-LPS and MLPF-WB-02D3 for STM32WB integrate the complete filtering and impedance-matching network needed for the best RF output power and receiver sensitivity with an external antenna. Each has 50Ω nominal…
STMicroelectronics offers multi-connectivity development kit for asset tracking
The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building a complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit also includes firmware to simplify the development of targeted applications, such as livestock monitoring, fleet management, and logistics. The kit helps users evaluate ST’s industry-first short and…
CARIAD and STMicroelectronics to co-develop chip for software-defined vehicles
New cooperation model for software-defined cars: CARIAD, the software unit of Volkswagen Group, and STMicroelectronics (ST), a global semiconductor provider serving customers across the spectrum of electronics applications, will shortly launch the joint development of an automotive system-on-chip (SoC). Together, CARIAD and ST are developing tailored hardware for connectivity, energy management, and over-the-air updates — making…
STMicroelectronics releases Bluetooth SoC with location tracking
STMicroelectronics has introduced its third-generation Bluetooth System-on-Chip (SoC), enhanced with Bluetooth direction-finding technology for location-tracking and real-time positioning applications. By determining the direction of a Bluetooth Low Energy (BLE) signal, the Bluetooth 5.3 certified BlueNRG-LPS SoC can precisely estimate movement and location with centimetre accuracy. It uses Bluetooth-specified technology including angle-of-arrival (AoA) and angle-of-departure (AoD), as…
Nexperia’s new level translators support legacy and future mobile SIM cards
Nexperia, an expert in essential semiconductors, announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next-generation, low-voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards. As processor geometries advance to single-digit nanometer nodes, the core voltage of advanced SoCs is…
Renesas launches highly advanced and integrated Bluetooth Low Energy SoC
Renesas Electronics Corporation announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions ― the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE…
Infineon adds AIROC CYW20820 Bluetooth & Bluetooth LE SoC to its portfolio
Infineon Technologies is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system-on-chip (SoC) to its AIROC Bluetooth Portfolio. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is a Bluetooth 5.2 core spec-compliant device tailor-made for IoT applications. It is designed to support a wide spectrum of use cases for home automation and sensors…
STMicroelectronics releases SoC solutions for keyless vehicle access
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, recently announced a new platform to accelerate the introduction of digital car keys, giving consumers keyless access to vehicles via their mobile device. In addition to strengthening security, digital car keys can deliver greater owner conveniences including customizable use privileges while continuing…
First RISC-V-based system-on-chip FPGA enters mass production
The first SoC Field Programmable Gate Array (FPGA) to support the royalty-free RISC-V open Instruction Set Architecture (ISA) has entered volume production, marking a major milestone in the evolution of embedded processors. As customers continue to adopt PolarFire SoC FPGAs at a rapid pace, Microchip Technology is announcing the production qualification for the MPFS250T and the previously…