Texas Instruments (TI) announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range of missions. TI developed a new device screening specification called space high-grade in plastic (SHP) for radiation-hardened products and introduced new analog-to-digital converters (ADCs) that meet the SHP qualification. TI also introduced…
TI offering wireless microcontrollers that enable high-quality Bluetooth LE
Texas Instruments (TI) has expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is built on the foundation of TI’s decades of wireless connectivity expertise.…
TI releases 24-bit wideband analog-to-digital converter
Texas Instruments (TI) has introduced the smallest 24-bit wideband analog-to-digital converter (ADC), which delivers signal-measurement precision at wider bandwidths than competing ADCs. The ADS127L11, the newest product in TI’s portfolio of precision wideband ADCs, achieves ultra-precise data acquisition in a 50-percent smaller package — significantly optimizing power consumption, resolution, and measurement bandwidth for a range…
Texas Instruments to construct 300-mm semiconductor wafer fabrication plants
Texas Instruments (TI) has announced plans to begin construction next year on its new 300-millimeter semiconductor wafer fabrication plants (or “fabs”) in Sherman, Texas. The North Texas site has the potential for up to four fabs to meet demand over time, as semiconductor growth in electronics, particularly in industrial and automotive markets, is expected to continue well…