MediaTek announced that it has successfully developed its first chip using TSMC’s 3nm technology — taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year. This marks a significant milestone in the long-standing strategic partnership between MediaTek and TSMC. Both companies are taking advantage of their chip design and manufacturing strengths to…
TSMC opens Advanced Backend Fab 6
TSMC recently announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) process technology. Advanced Backend Fab 6 enables TSMC to…
TSMC launches OIP 3DFabric Alliance
TSMC recently announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum. The new TSMC 3DFabric Alliance is TSMC’s sixth OIP Alliance and the first of its kind in the semiconductor industry that joins forces with partners to accelerate 3D IC ecosystem innovation and readiness — with a full…
TSMC introduces N4X process for high-performance computing products
TSMC is introducing its N4X process technology, tailored for the demanding workloads of high-performance computing (HPC) products. N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the five-nanometer family. The “X” designation is reserved for TSMC technologies that are developed specifically for HPC products. Leveraging its experience…
TSMC announces advanced N4P process technology
TSMC recently introduced its N4P process, a performance-focused enhancement of the 5-nanometer (N5) technology platform. N4P joins the industry’s most advanced and extensive portfolio of advanced technology processes. With N5, N4, N3, and the latest addition of N4P, TSMC customers will have multiple and compelling choices for power, performance, area, and cost for its…
TSMC commits to reach net-zero emissions by 2050
TSMC recently published its Task Force on Climate-related Financial Disclosures (TCFD) Report, becoming a semiconductor industry frontrunner in climate disclosure while taking actions toward its environmental sustainability goals. As a responsible corporate citizen, TSMC strives to adapt to climate change and mitigate climate impact to protect our shared global environment. Guided by its ESG Policy…
NXP ramps up automotive processor production with TSMC technology
NXP Semiconductors, a provider in automotive processing, teamed up with TSMC to release NXP’s S32G2 vehicle network processor and the S32R294 radar processor. These products are now in volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology. This marks the migration of NXP’s S32 family of processors to increasingly advanced process nodes as…