TI releases power-management chips for 800 VDC data centers

Texas Instruments introduced power-management chips and design resources at Open Compute Summit in San Jose, California, from October 13-16. The products address power delivery requirements as data centers scale from 12V to 48V to 800VDC architectures.

The company released a white paper developed in collaboration with NVIDIA examining power delivery trade-offs for 800 VDC power architecture. The paper addresses design challenges and opportunities for energy conversion as IT rack power approaches 1MW within two to three years. The analysis covers efficiency and power-density considerations at the system level.

TI’s 30kW AI server power-supply reference design features a dual-stage configuration with a three-phase, three-level flying capacitor power factor correction converter and dual delta-delta three-phase inductor-inductor-capacitor converters. The design supports either a single 800V output or separate output supplies.

The CSD965203B dual-phase smart power stage delivers 100A of peak current per phase in a 5mm-by-5mm quad flat no-lead package. The design allows engineers to increase phase count and power delivery across a limited printed circuit board area. The CSDM65295 dual-phase smart power module provides up to 180A of peak output current in a 9mm-by-10mm-by-5mm package, integrating two power stages and two inductors with trans-inductor voltage regulation options.

The LMM104RM0 gallium-nitride intermediate bus converter delivers up to 1.6kW in a quarter-brick form factor, achieving over 97.5% input-to-output power-conversion efficiency with active current sharing capability between multiple modules.