Toshiba recently announced the introduction of its new JEDEC e.MMC (embedded Multi-Media Card) Version 5.1 that complies with embedded NAND flash memory chips for applications related to computer-on-modules, consumer applications, factory automation equipment, and PLCs. Toshiba realizes that demand for extreme temperature support has been growing in industrial and consumers markets at a rapid pace. In order to meet the high side of mercury rise, it came up with a new line-up of chips that can bear through a range of 85-100 degree centigrade. The complete range of temperature ranges of the JEDEC e.MMC chips goes from -40 degree centigrade to 105 degree centigrade that is very suitable for very high-temperature industry-based applications.
The new chips are offered with the dimension of 11.5mm x 13.0 mm 153BAll FBGA package whose thickness ranges between 0.1mm – 1.2 mm as per its capacity. It has been designed with the help of 15nm process technology and chips come with a data storage ability of 8 GB, 16 GB, 32 GB, as well as 64 GB. its e.MMC products bring together the benefits of a flash memory controller and flash memory over similar silicon die. This led to the simplification of product development process because the chips were able to take care of all essential functions along with driver software, error correction, and block management writing.
Apart from this, e.MMC Version 5.1 also standardizes some new features like BKOPS control, large RPMB write, command queuing, cache flash reporting, as well as cache barrier. This version also gives complete support for AEC-Q100 Grade 2 needs and requirements that can meet all automotive applications. The sample shipments of these chips have already been forwarded and the mass production in dated to begin by March 2017.
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