Flip-Chip Pin Grid Array is a form of PGA IC packaging design popularized by Intel’s Celeron and Pentium line of processors where the chip is located on the side away from the motherboard and is attached to the motherboard using the arrayed pin grids on the bottom of the chip which fit in easily into the sockets designed for that line of processors like the Zero Insertion Force Socket 370 and Socket 478. Here, the back of the die is exposed allowing direct contact with heat-sink thus eliminating the need to use additional hardware like thermal plate or heat spreader.
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