Yamaichi Electronics, a market leader for Test & Burn-In sockets, connectors, and connect on systems, has released a new connector. It has been developed for the recent CFP8 specification for 400 Gbps applications. Complying with the CFP MSA Multi-Source Agreement, this device is one of the few connectors in the world market that can achieve 400 Gbps of the transmission rate.
Carrying the same size as the CFP2, the CFP8 has a 4 times higher performance so as to achieve 400 Gbps instead of limiting to 100 Gbps. Besides, it supports configurations like 25 Gbps x 16 channels, 50 Gbps x 8 channels, or 100 Gbps x 4 channels.
Yamaichi Electronics Develops World’s First Connector for 400 Gbps Ethernet
(Image Courtesy: Yamaichi Electronics)
The pin count is 124 pins whereas the narrow pitch measures just 0.5 mm which is one of the most challenging achievements of Yamaichi Electronics. At 4 times the transmission speed of CFP2, this latest connector excels through a smaller contact pitch.
Moving on to the mechanical kit of the CFP series, it contains cage connector cover, heat sink and an optional clip to fasten the heatsink to the cage. The CFP2 mechanism uses a clip to hold the heatsink while the CFP4 and CFP8 are devoid of clips.
The complete lineup of CFP, CFP2, CFP2 56Gbps and CFP4 connector systems has already been made available. It is based on the MSA specification and supports major customers’ 100 G applications. The newly added CFP8 is in mass production at Yamaichi Electronics and is fully available.
About Yamaichi Electronics
Yamaichi Electronics is a market leader for Test & Burn-In sockets, connectors and connection systems. Their reliability and functional dependability are absolutely essential for the success of the overall project. Yamaichi Electronics established themselves on the world market very quickly as a manufacturer of high-quality, reliable components for demanding applications in various markets and applications: semiconductor, industrial automation, automotive, data networking, measurement & testing, medical, mobile computing, embedded computing, and others.
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