Point2 Technology announced its P1B121 Smart Retimer system-on-chip (SoC) for Active Electrical Cable (AEC) applications in AI/ML data centers. The chip integrates eight unidirectional SerDes channels supporting 112G PAM4 and 56G NRZ data rates and consumes 3.0 W of power for 112G PAM4 operation. The solution addresses growing data center power demands, as AI/ML workloads…
Apex expands IC line with 350 V multi-channel architecture
Apex Microtechnology announced the addition of two new devices to its Precision IC product line: an 8-channel driver and a photo receiver amplifier IC. These devices join the family of nine linear amplifier ICs and four driver and sensor ICs, expanding the range of products providing supply voltages up to 350V with multi-channel architectures. The…
onsemi launches 65 nm platform for automotive and industrial applications
onsemi has launched its Treo Platform, an analog and mixed-signal platform using Bipolar-CMOS-DMOS (BCD) process technology on a 65 nm node. The platform supports voltage ranges from 1-90 V and operating temperatures up to 175° C, designed to serve automotive, medical, industrial, and AI data center applications. The platform’s modular architecture helps customers streamline design…
Power Integrations develops 1700 V GaN switch for multi-output applications
Power Integrations has unveiled the 1700 V InnoMux-2, a gallium nitride (GaN) switch designed for high-voltage power semiconductors. The technology integrates into the company’s InnoMux-2 power supply IC family, engineered for multi-output power supplies operating from high-voltage DC sources. Andy Smith, Director of Training at Power Integrations, explained, “The new device is fabricated using our…
Home-made cables connect Bluetooth audio adapter
After buying a Bluetooth audio adapter at a yard sale, I just needed cables for audio and power. Buy them? No way. How many times have you thought about buying something, then thought “I’m an engineer, I can figure out a workaround” or simply decided not to spend money? It’s happened to me several times.…
NXP releases edge computing platform with language model support and privacy features
Two new tools have been added to the eIQ AI and machine learning development platform, expanding capabilities for edge AI deployment across multiple processor types. The eIQ Time Series Studio offers a streamlined machine learning workflow for time series models, specifically targeting MCU-class devices in the MCX and i.MX RT crossover families. The Time Series…
Traco Power introduces 300 W AC-DC power supplies for industrial applications
A new series of AC-DC power supplies has been introduced to the market. The TXO 300 series is part of a broader family of power supplies expected to reach up to 500 watts in future iterations. This product line aims to provide efficient power solutions for industrial applications. The newly released series boasts a compact…
BrainChip launches co-processor for wearable and IoT AI applications
BrainChip Holdings Ltd has introduced the Akida Pico, a power-efficient acceleration co-processor. This new product enables the creation of compact, energy-efficient, portable, and intelligent devices for wearable and sensor-integrated AI applications in consumer, healthcare, IoT, defense, and wake-up sectors. Akida Pico accelerates specific neural network models to create an energy-efficient, digital architecture. It enables secure…
Eggtronic introduces high-frequency wireless power eval kit for IoT
Eggtronic has unveiled a new evaluation board that allows engineers to quickly develop and prototype ultra-efficient, low-component count wireless power transfer designs for low-power applications. The WaveEgg Low-Power (LP) EVB is built on Eggtronic’s proprietary, high-frequency WaveEgg architecture, which optimizes performance and efficiency and reduces component count and form factor in high-performance power converter and wireless power transmission…
binder unveils new flange components for PBC15 connector system
binder has announced the release of new flange components designed to complement their PBC15 cable connector system. These components have been engineered to meet the demanding requirements of modern industrial applications, particularly in environments where space is at a premium and high current and voltage transmission is essential. The PBC15 system, enhanced by these new…
NXP’s MCU features 325 MHz Cortex-M33 with 172x AI acceleration
NXP Semiconductors has introduced the i.MX RT700 crossover MCU family, designed for AI-enabled edge devices. The i.MX RT700 integrates up to five cores, including a primary Arm Cortex-M33 running at 325 MHz, a Cadence Tensilica HiFi 4 DSP for advanced audio processing, and NXP’s eIQ Neutron Neural Processing Unit (NPU). The MCU offers up to…
Nexperia releases small-signal MOSFETs in DFN1110D-3 and DFN1412-6 packages
Nexperia announced the release of single and dual small-signal MOSFETs in miniature DFN packages. The automotive-qualified devices are available in DFN1110D-3 and DFN1412-6 respectively. Particularly the DFN1110D-3 (1.1mm x 1 mm) package has seen increasingly wide adoption and is quickly becoming the ‘de-facto’ industry standard package for small-signal MOSFETs and bipolar transistors intended for use…
UEI introduces I/O board with configurable digital inputs and outputs
United Electronic Industries (UEI) unveiled its latest innovation, the DNx-MF-102 multifunction analog and digital I/O board with 2 CAN ports compatible with all UEI I/O chassis systems. The board offers a powerful combination of 34 analog and digital I/O channels combined with, two CAN ports and one RS-232/422/485 port. This board is integral to any…
Marktech introduces 25ns response time silicon photodiodes
Marktech Optoelectronics has introduced new Series 4 silicon photodiodes with improved response speed. These photodiodes offer a response time of 25ns compared to the 80ns of current Series 4 PDs with the same active area. The new silicon photodiodes feature reduced junction capacitance (Cj), which improves response time, frequency response, and bandwidth. This is achieved…
TDK launches 6.00 x 5.60 x 6.40 mm MLCCs for automotive applications
TDK Corporation has expanded its automotive-grade CA series of MEGACAP MLCCs with a metal frame, commencing mass production in September 2024. The CA series MLCCs measure 6.00 x 5.60 x 6.40 mm and feature a 3-line type structure. The lineup includes 99 nF/1000 V variants with a Class 1 dielectric and 47 μF/100 V variants…
Diodes Incorporated expands automotive Hall Effect switch IC portfolio
Diodes Incorporated announces the addition of two enhanced high-voltage, Hall effect switch IC families to its automotive-compliant* product portfolio. The AH332xQ (unipolar) and AH352xQ (omnipolar) offer a wide range of operating sensitivity options in SIP-3, SOT23 (Type S), and SC59 packages. The devices can be used in a broad range of contactless position and proximity…
TDK launches 3000 W programmable power supply in 270mm case
TDK Corporation introduces the HWS3000 programmable AC-DC power supplies in the TDK-Lambda series. These units deliver up to 3000 watts in a 270 x 150 x 61mm case size. The HWS3000 offers programmable output voltages of 24V, 48V, 60V, or 130V, with the ability to adjust from zero to maximum rating. Engineers can choose between…
Magnachip launches low 1.8 V gate threshold MOSFETs for vehicle systems
Magnachip Semiconductor Corporation announced the release of four new 40V 1)MXT MV MOSFETs designed in Power Dual Flat No-Lead (PDFN) 33 packages for automotive applications. As automotive technologies like autonomous driving and infotainment systems advance, the number and variety of motors installed in vehicles are increasing. Consequently, there is a growing importance for high-performance MOSFETs…
Eggtronic releases evaluation board for 240 W power delivery applications
Eggtronic has unveiled an evaluation board (EVB) that allows engineers to speed the development and significantly reduce the size and cost of 240W power delivery (PD) 3.1 applications while supporting ultra-fast charging through industry-leading efficiency. The SmartEgg 240W PD 3.1 EVB has a peak efficiency above 95% and operates at over 90% efficiency from light…
OMNIVISION’s image sensor supports 50MP resolution and enhanced telephoto crop-zoom
OMNIVISION has introduced the OV50M40, the latest addition to its mobile product portfolio. The OV50M40 is a versatile 50-megapixel (MP) CMOS image sensor with a 0.61-micron (µm) pixel size, designed to enhance front, main, ultra-wide, and telephoto cameras in smartphones. The OV50M40 image sensor supports both staggered HDR and dual analog gain (DAG) HDR technology.…