Infineon Technologies has opened a new laboratory for the development of quantum electronics in Oberhaching near Munich. The objective is to develop and test microelectronic circuits for quantum computers, which will be stable and small, will operate reliably and can be produced on an industrial scale. Approximately 20 researchers will work at the lab. In…
Intel launches industry’s first AI PC Acceleration program
Building on the AI PC use cases shared at Innovation 2023, Intel has launched the AI PC Acceleration program, a global innovation initiative designed to accelerate the pace of AI development across the PC industry. The program aims to connect independent hardware vendors (IHVs) and independent software vendors (ISVs) with Intel resources that include AI…
Harwin’s 1.25mm pitch Gecko connectors are a success
Harwin announces that its high-reliability Gecko connectors, which have been integrated into a research nanosatellite, have been successfully launched and ejected into low Earth orbit (LEO), and, after the deployment of its subsystems, remain fully operational. Momentus, the U.S. commercial space company, recently announced that all customer payloads had been deployed from its Vigoride-6 Orbital Service…
Infineon launches new MCUs for automotive graphic applications
Infineon Technologies announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications. With a small footprint, the new MCUs simplify OEM integration and reduce BOM costs, making them an ideal solution for advanced…
STMicroelectronics offers op amps for sensor signal conditioning
STMicroelectronics’ TSB182 dual-operational amplifier is featured for high-accuracy signal conditioning with sensors, including maximum 20µV input offset voltage, 100nV/° C drift over temperature, and 4V-36V operating range for medium-voltage applications. In addition to its high accuracy, stability, and wide supply-voltage range, the TSB182 is specified from -40° to 125° C. With a maximum offset voltage of…
NVIDIA and Tata Group to build large-scale AI infrastructure
NVIDIA announced an extensive collaboration with Tata Group to deliver AI computing infrastructure and platforms for developing AI solutions. The collaboration will bring state-of-the-art AI capabilities within reach to thousands of organizations, businesses, AI researchers, and hundreds of startups in India. The companies will work together to build an AI supercomputer powered by the next-generation NVIDIA GH200…
Samsung delivers 4G calls over-shared Open RAN in pilot project
Samsung Electronics, with Vodafone and Orange, two of the largest operators in Europe, announced the companies completed the first 4G calls over-shared commercial networks in rural areas of Romania based on Open RAN in a pilot project. By leveraging Samsung’s virtualized Radio Access Network (vRAN), the two operators can take advantage of the greater flexibility…
Difference between LOS and NLOS in Wireless LoRa Technology
In today’s world of communication, Long Range (LoRa) technology has taken a significant role, providing strong, long-distance connections. LoRa’s way of sending signals and its impressive reach make it an ideal option for many direct and indirect network paths. This article explores how LoRa works in two situations: when devices can see each other (line-of-sight…
Nexperia and KYOCERA AVX to produce silicon-carbide rectifier module
Nexperia, a semiconductor provider, announced it has entered into a partnership with KYOCERA AVX Components, an international supplier of advanced electronic components, to jointly produce a new 650 V, 20 A silicon-carbide (SiC) rectifier module. The new rectifier module will be for high-frequency power applications ranging from 3 to 11 kW power stack designs —…
AMD launches Kria K24 System-on-Module with starter kit
AMD recently announced the AMD Kria K24 System-on-Module (SOM) and its new KD240 Drives Starter Kit, which are the latest additions to the Kria portfolio of adaptive SOMs and developer kits. AMD Kria K24 SOM offers power-efficient computing in a small form factor and targets cost-sensitive industrial and commercial edge applications. Advanced InFO (Integrated Fan-Out)…
Microchip’s RT PolarFire FPGA achieves QML Class Q qualification
Products that have Qualified Manufacturers List (QML) designations are often the most trusted and readily accepted in space program designs. As designated by the Defense Logistics Agency (DLA), the RT PolarFire FPGA from Microchip Technology is now QML Class Q qualified. This certification is considered the gold standard in entry-level qualification, enabling designers to begin…
AMD unveils new fintech accelerator card
AMD announced the AMD Alveo UL3524 accelerator card, a new fintech accelerator designed for ultra-low latency electronic trading applications. Already deployed by leading trading firms and enabling multiple solution partner offerings, the Alveo UL3524 provides proprietary traders, market makers, hedge funds, brokerages, and exchanges with a state-of-the-art FPGA platform for electronic trading at nanosecond (ns) speed.…
Broadcom launches low-power transceiver technology
Broadcom Inc. announced the availability of its 5nm 200G/lane optical PAM-4 DSP PHY, the Sian BCM85822, at the 49th European Conference on Optical Communication (ECOC 2023). The new BCM85822 features 200G/lane serial optical interfaces, which enable optical transceiver manufacturers to cost-effectively deliver 800G and 1.6T pluggable modules and meet the growing bandwidth needs and low power consumption…
Microchip adds to its mid-range FPGA and SoC support
Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are twin priorities, and the need for cradle-to-grave security continues to grow. Satisfying these simultaneous demands requires immediate knowledge of special technology and vertical-market expertise. There’s no…
STMicroelectronics introduces all-in-one automotive power-management IC
STMicroelectronics‘ new SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver, and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help…
Keysight launches phased array antenna control and calibration solution
Keysight Technologies has introduced its new Phased Array Antenna Control and Calibration solution, a breakthrough over-the-air (OTA) calibration and characterization solution that enables satellite designers to develop active electronically scanned arrays for satellite communications applications to rapidly test their designs during early validation. Modern satellite networks operate at higher frequencies and use active phased array…
Texas Instruments introduces new opto-emulator portfolio
Texas Instruments (TI) has introduced its new opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications. TI’s inaugural opto-emulators are pin-to-pin compatible with the industry’s most common optocouplers, enabling seamless integration into existing designs while leveraging the unique benefits of…
Qualcomm launches new XR and AR platforms with immersive experiences
Qualcomm Technologies has announced two new spatial computing platforms — Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 — which will enable the next generation of mixed reality (MR), virtual reality (VR) devices, and smart glasses. Snapdragon XR2 Gen 2 Platform: brings premium MR and VR technology into a single-chip architecture to unlock next-level…
Keysight EDA integrates “shift left” software design cycles
Keysight Technologies introduces the Keysight EDA 2024, a tightly integrated suite of electronic design automation (EDA) software tools that ensure first-pass success. This new integrated EDA software facilitates a “shift left” approach to increase productivity for engineers developing high-speed, high-frequency products in multiple applications. “Shift left” is an established electrical engineering practice that moves design…
Rohde & Schwarz and ETS-Lindgren partner on 5G A-GNSS antenna performance testing
ETS-Lindgren and Rohde & Schwarz are continuing their long-term collaboration and have enabled antenna performance measurements with comprehensive assisted global navigation satellite system (A-GNSS) capabilities for 5G NR. The R&S CMX500 OBT wide-band radio communication tester and the R&S SMBV100B GNSS simulator in conjunction with EMQuest software from ETS-Lindgren support current and evolving 5G NR…