News

STMicroelectronics, a global semiconductor, is easing the design of competitively priced and power-efficient wireless equipment for applications like smart buildings, smart industry, and smart infrastructure by introducing new development tools and software for STM32WB wireless microcontrollers (MCUs). ST’s highly integrated STM32WB contains a 2.4GHz radio, Arm Cortex-M4, and Cortex-M0+ MCU on the same chip, which eliminates several…

STMicroelectronics’ STWLC98 integrated and wireless power receiver delivers faster wireless charging and flexible charge sharing for diverse portable and mobile devices for home, office, industry, healthcare, and in-car applications. When combined with the STWBC2-HP transmitter IC, the complete transmitter-receiver system can deliver up to 70W on the receiver end at high system efficiency. The STWLC98…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its environmental sensor portfolio with its first family of thermopile-based detectors with integrated optical filters for optical (NDIR) CO2 sensors. The four new single and dual-channel analog detectors for CO2 gases deliver the industry’s top performance, quality, and longevity in a TO-5 package —…

STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has announced a design win for STM32WLE5 — the world’s first LoRa System-on-Chip (SoC). The customer application, developed by automated rubber-tapping specialist CIHEVEA, uses the low-power networking to revolutionize the automation of extracting latex from rubber trees. CIHEVEA has equipped more than 200,000…

This blog post is written by Wendy Jane Preston., with images courtesy of Harwin. Click here to read the full article. The Industrial Internet of Things (IIoT) enables a high level of automation within manufacturing and processing facilities. It helps companies achieve real progress to improve efficiency, productivity, and output quality. This is the heart…

Nexperia, a semiconductor provider, announced that one of its surface-mount device packages — the clip-bond FlatPower package CFP15B — has passed Board-level Reliability (BLR) testing for automotive applications by a top Tier 1 supplier. Initially, the FlatPower package will be used in an engine-control unit. BLR provides a means of evaluating the reliability of semiconductor…

Vishay Intertechnology has introduced a new series of AEC-Q200-qualified, high-power, thin-film wraparound chip resistors. The Vishay Dale Thin Film PHPA series devices combine power ratings of 1.0 and 2.5 W in the 1206 and 2512 case sizes, respectively, with a self-passivated, tantalum-nitride film for high moisture resistance. The devices are available for automotive power supplies,…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and OmniVision Technologies, a developer of advanced digital imaging solutions, have introduced an integrated reference design for a high-definition automotive camera system. The new design features Renesas’ recently introduced Automotive HD Link (AHL) technology that transmits high-definition video over low-cost cables and connectors. The AHL components…

STMicroelectronics, a global semiconductor provider, and Blues Wireless, a telecoms equipment supplier, have disclosed the use of a quintet of ST products in Blues Wireless’ Notecard, a system-on-module (SOM) solution that accelerates development of cellular IoT solutions for connected assets at a low cost. The Blues Wireless Notecard builds on a high-performance, ultra-low-power STM32L4R5 microcontroller, an STSAFE-A…

Texas Instruments (TI) has introduced the industry’s first 70-W brushless DC (BLDC) motor drivers to provide code-free, sensorless trapezoidal and field-oriented control (FOC). The devices enable engineers to spin a BLDC motor in less than 10 minutes — eliminating months of design time for engineers designing a wide variety of industrial systems (such as major…

Infineon Technologies and Panasonic Corporation have signed an agreement for the joint development and production of the second generation (Gen2) of their proven gallium-nitride (GaN) technology, offering higher efficiency and power density levels. The outstanding performance and reliability combined with the capability of 8-inch GaN-on-Si wafer production mark Infineon’s strategic outreach to the growing demand for…

Samsung Electronics, a provider of advanced semiconductor technology, announced that four of its System LSI products received product carbon-footprint label certification from the Carbon Trust — the first of Samsung’s logic chips to do so. Having received the semiconductor industry’s first carbon-footprint accreditation for memory chips from the Carbon Trust in 2019, Samsung has now…

In power electronics and the semiconductor market the system approach is gaining momentum. To support this trend, Infineon Technologies is introducing a pre-tested industrial reference design that significantly reduces the time to market. The reference design is a general-purpose motor drive that features a nominal power of 22 kW and can be operated directly on…

Vishay Intertechnology has introduced the industry’s first automotive-grade, IHLP low-profile, high-current inductor in the 19 X 19 X 7mm, 7575 case size. Offering high-temperature operation (to +155° C) for under-the-hood automotive applications, the Vishay Dale IHLP-7575GZ-5A offers up to 30 percent lower DCR and up to 35 percent higher current ratings than devices in the…

Infineon Technologies recently launched new current ratings for its EconoDUAL 3 portfolio with TRENCHSTOP IGBT7 chips. With the broad range of current classes from 300 up to 900 A, the portfolio offers inverter designers a high degree of flexibility while also providing increased power density and performance. In addition to solar and drive applications, the portfolio is…

Vishay Intertechnology has introduced a new series of AEC-Q200-qualified, thick-film chip resistors with operating voltages up to 3 kV in the 2010 and 2512 case sizes. With their high-operating voltages, devices in the Vishay Draloric RCV-AT e3 series can be used in place of standard resistor chains. This allows designers to save board space in…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, recently introduced the RX671 group of 32-bit microcontrollers (MCUs), adding a new high-performance, high-functionality single-chip solution with touch-sensing and voice-recognition capabilities for contactless operation to the popular RX Family. Part of Renesas’ mainstream RX600 Series, the RX671 MCUs are built around an RXv3 CPU core operating…

Routers, switches, and line cards need higher bandwidth, port density, and up to 800-gigabit Ethernet (GbE) connectivity to handle escalating data-center traffic driven by 5G, cloud services and artificial intelligence (AI) and machine learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the industry’s transition…

STMicroelectronics announced the first multi-zone FlightSense time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products. The VL53L5CX sensor provides up to 64 sensing zones with multi-target detection, distance measurement up to four meters in each zone, and a wide square-edged field of view with…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that it has expanded its popular Lab on the Cloud environment to simplify the configuration and testing process and speed time to market. The company has enhanced its cloud-connected lab with advanced GUI features and new design parameters that create a more engaging and ergonomic…