Components

Nexperia, a semiconductor provider, has extended its portfolio of Trench Schottky rectifiers with devices rated at up to 100 V and 20 A. The new parts feature excellent switching behavior and top thermal performance. They’re available in Nexperia’s Clip Bond FlatPower (CFP) packages which have a much smaller footprint than SMA/SMB/SMC components. Trench technology results…

Melexis, a global microelectronics engineering company, is targeting white goods, consumer electronics, and smart-metering applications with the MLX90392 three-axis magnetic field sensor, which can operate from a 1.8 V power rail shared with other components such as logic devices. Requiring no dedicated LDO or regulator, the competitively priced MLX90392 simplifies design, trims bill-of-materials costs and saves PCB…

Samsung Electronics, a provider of advanced semiconductor technology, has announced the immediate availability of its next-generation 2.5D packaging technology Interposer-Cube4 (I-Cube4), advancing chip-packaging technology even further. Samsung’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several high-bandwidth memory (HBM) dies on top of a silicon…

Diodes Incorporated has further expanded its video passive multiplexer and de-multiplexer (mux/demux) switch portfolio with the introduction of the 4-channel PI3WVR14412. Supporting up to 20Gbps operation, this 2:1/1:2 mux/demux device provides speeds beyond those of other products on the market — resulting in a 35% increase over what is offered by competitors. The PI3WVR14412 is…

Rapid technology and market developments in the fast-charger and adapter markets continuously challenge designers of power supply systems. To meet the increasing demand for higher-power density and energy efficiency, Infineon Technologies AG is expanding its XDP family by adding the first application-specific standard product based on an asymmetric half-bridge flyback topology. Available in a DSO-14…

Maxim Integrated Products, Inc. and Aizip Inc. — a company focused on artificial intelligence (AI) for applications in the Internet of Things (IoT) — recently announced that Maxim Integrated’s MAX78000 neural-network microcontroller detects people in an image using Aizip’s Visual Wake Words (VWW) model at just 0.7 millijoules (mJ) per inference. This is 100 times lower…

Power switches based on the wide bandgap (WBG) material gallium nitride (GaN) enable excellent efficiency and high-switching frequency, starting a new era in power electronics. To support this development, Infineon Technologies AG is adding the new CoolGaN IPS family of integrated power stage (IPS) products to its broad portfolio of WBG power devices. The initial IPS…

The PI3USB4000DQ/4002AQ are Diodes Incorporated’s first automotive-compliant USB 2.0, passive-signal, multi and de-multiplexer (Mux/Demux) switches. The PI3USB4000DQ is a 2:1/ 1:2 Mux/Demux and the PI3USB4002AQ is a 1:1 switch. These USB 2.0 switches muxes incorporate high-voltage signal and power rail protection. Using a unique design technology, the PI3USB400xxQ has a 24-VDC withstand on the high-speed…

Vishay Intertechnology, Inc. in launching a new series of metallized polypropylene AC-filtering film capacitors optimized for high-humidity environments. The Vishay Roederstein MKP1847C AC Filtering devices withstand demanding temperature humidity bias (THB) testing — 40° C, 93-percent relative humidity for 56 days at rated voltage — without altering their electrical characteristics. The capacitors are designed to…

Highest efficiency is a key requirement for today’s power electronics. With this in mind, Infineon Technologies AG is introducing its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate-driver family in a compact form factor. The gate-driver family comes in an 8mm wide-body package to ensure easy design-in and integrates a two-level, slew-rate control, which significantly improves…

Infineon Technologies AG has upgraded its EasyDUAL CoolSiC MOSFET modules with a new aluminum-nitride (AIN) ceramic. The devices come in half-bridge configuration with an on-state resistance (R DS(on)) of 11 mΩ in an EasyDUAL 1B package and 6 mΩ in an EasyDUAL 2B package. With high-performance ceramic, the 1200 V devices are suitable for high-power…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that AMI — a firmware and software solutions partner — has qualified the Renesas I3C bus-extension products for its MegaRAC SP-X Remote Management Firmware. Including the I3C devices on AMI’s approved vendor list enables an easy migration path for customers shifting their DDR5 platforms…

Deep space initiatives including planetary exploration, orbiter missions, and space research require innovative spacecraft system technology providing connectivity and processing. To enable system designers better integration and higher performance while reducing development costs and time to market, COTS technologies and scalable solutions are increasingly used in space applications. Microchip Technology Inc. has announced the qualification…

Semtech Corporation, a supplier of high-performance analog, mixed-signal semiconductors, and advanced algorithms, has announced the launch of a new product in its LoRa Core portfolio: the LoRa Corecell Reference Design for full-duplex gateway applications in the U.S. 902 – 928MHz ISM band. The new turnkey gateway solution enables the expansion of network capacity for outdoor and indoor applications, such…

Samsung Electronics has announced the industry’s highest-performing 24G SAS (SAS-4) SSD:  the PM1653. Based on the latest SAS interface, the new drive can support twice the speed of the previous 12G SAS-3 generation. The PM1653 is also the industry’s first 24G SAS SSD made with sixth-generation (1xx-layer) V-NAND chips, enabling storage capacities from 800GB to…

Vishay Intertechnology, Inc. is introducing a new, extended temperature “E” option for its TSSP77038 infrared (IR) sensor module in the Heimdall package. Designed to meet the special requirements of outdoor applications, the Vishay Semiconductors TSSP77038ETR has been enhanced with a storage temperature range of -40° to +110° C and an operating temperature range of -30°…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its timing solutions portfolio with a new sub-100fs point-of-use clock solution for data center, server, and network infrastructure markets. The new FemtoClock2 family includes ultra-low jitter clock generators and jitter attenuators in a small 4×4 mm2 package, enabling cost-effective and simple clock tree implementation…

Nexperia, a semiconductor provider, recently announced a new range of ESD-protection devices aimed specifically at the ever-increasing number of high-speed interfaces found in automotive applications — and, particularly, the in-vehicle networks (IVN) associated with infotainment and vehicle communications. As data rates increase and vehicles feature more electric content, the need for EMC protection becomes more…

Lattice Semiconductor, the low-power programmable provider, recently expanded its award-winning Lattice Crosslink-NX family with new FPGAs specified for automotive applications — such as advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems. The new CrossLink-NX FPGAs bring best-in-class low power, small form factor, high-performance I/O, and reliability to embedded-vision applications for today’s technologically advanced…

Xilinx, Inc. is introducing the Kria portfolio of adaptive system-on-modules (SOMs), production-ready, small form factor embedded boards that enable rapid deployment in edge-based applications. Coupled with a complete software stack and pre-built, production-grade accelerated applications, Kria adaptive SOMs are a new method of bringing adaptive computing to AI and software developers. The first product available…