Components

Analog Devices‘ ADT7422 is a high-accuracy, digital I2C temperature sensor that’s designed to meet the clinical thermometry specification of the ASTM E1112 standards when soldered onto the final printed circuit board (PCB). The ADT7422 contains an internal band gap reference, a temperature sensor, and a precision analog-to-digital converter (ADC). The ADT7422 provides a 16-bit temperature…

Analog Devices‘ new AD-FMCLIDAR1-EBZ is an FMC compatible modular hardware platform for LIDAR prototyping. It offers flexibility to simplify the complexities of LIDAR development, meet individual design needs, and narrow down the time to market. The platform has an open-source software framework that can integrate into customer designs and wrappers for Python and MATLAB. Additionally,…

Texas Instruments TPSM5360x Power Modules are highly integrated 2A (TPSM53602), 3A (TPSM53603), or 4A (TPSM53604) power solutions with a 36V input. Each device combines a step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5mmx5.5mmx4mm, 15-pin QFN package uses routable lead-frame technology for enhanced thermal performance, small…

Schneider Electric, a global specialist in the digital transformation of energy management and automation, announced the expansion of the PowerLogic ION9000 series power meter range with the PowerLogic ION9000T. Based on the PowerLogic platform, the new ION9000T adds high-speed transient capture capabilities, helping critical facilities avoid outages, equipment damage, failures, and interruption of operations. Originating…

Saft recently launched a new product in the Xcelion line, the Xcelion 56V-LEV battery, designed as a more economical option for low-current, 48V continuous cycling applications, particularly in the defense industry. This development represents the growth of the Xcelion product line, aimed at offering lower weight, longer life, and greater overall capability and intelligence compared to traditional…

Vishay Intertechnology, Inc. has launched a new 80 V TrenchFET Gen IV n-channel power MOSFET in the 6.15 mm by 5.15 mm PowerPAK SO-8 single unit. Designed to save energy by increasing the efficiency of power conversion topologies and switching circuitry, the Vishay Siliconix SiR680ADP offers best in class on-resistance times gate charge — a key figure…

Infineon Technologies AG is focusing on system innovation with enhancements at the component level by addressing the challenges of modern power management designs. The Source Down is a new industry standard packaging concept. The first wave of power MOSFETs launched in this new package is the OptiMOS  25 V in a PQFN 3.3×3.3 mm. The…

Intel Labs recently released a research paper at the 2020 International Solid-State Circuits Conference in San Francisco, which discusses the major technical aspects of Intel’s new cryogenic quantum control chip, Horse Ridge. Horse Ridge offers impressive technical capabilities, essentially taking care of all of the issues that pertain to the design of a powerful quantum…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, recently announced the industry’s first single-chip synchronous buck and low dropout (LDO) regulator targeting low-power FPGAs, DDR memory and other digital loads for spaceflight payload applications. The ISL70005SEH is the only point-of-load (POL) power solution that reduces size, weight, and power (SWaP) by integrating a synch…

A team of researchers from United College London and the Chinese Academy of Sciences recently had an interesting breakthrough. They were able to come up with a bendable graphene supercapacitor that charges at an extremely quick speed and securely stores high volumes of energy. The new supercapacitor is definitely worthy of its name. It has…

A team of MIT engineers recently developed a process that may become the key to stretchable electronics. They finally found a way to get over the rigidity of computer chips located in the core of all electronic devices. The aim is to make flexible, more multi-functional electronic devices. The new process is known as “remote…

A team of engineers from the University of New South Wales, Australia recently found a new way to create more stable quantum chips. It is done by increasing the stability of artificially produced atoms over silicon chips. This results in the production of more consistent quantum qubits or bits. The new research takes roots in…

Arm recently announced significant additions to its artificial intelligence (AI) platform, including new machine learning (ML) IP, the Arm Cortex-M55 processor and Arm Ethos-U55 NPU, the industry’s first microNPU (Neural Processing Unit) for Cortex-M, designed to deliver a combined 480x leap in ML performance to microcontrollers. The new IP and supporting unified toolchain enable AI…

Renesas Electronics RV1S92xxA/22xxA 8.2mm Creepage Photocouplers are optically coupled isolators containing a light-emitting diode. The package is extremely small and thin with a long creepage distance (8.2mm). These products are suitable for various interface circuits, which require surface mounting and high-density mounting. Features ● Long and small creepage (LSSOP, 8.2mm) ● High isolation voltage i.e.…

Nokia recently came up with Nokia Network Operations Master to offer highly automated and scalable software to communication service providers (CSP). The software will play a key role in the management of 5G networks. “5G networks will require significantly more operations automation than past networks in order to achieve promised levels of efficiency and new…

Texas Instruments‘ AFE79xx is a family of high-performing, wide bandwidth multi-channel transceivers integrate several features, including: Four RF sampling transmitter chains Four RF sampling receiver chains Up to two RF sampling digitizing auxiliary chains (feedback paths). The dynamic range of the transmitter and receiver chains allows generating and receiving 3G, 4G, and 5G signals for…

NXP Semiconductors recently announced the availability of QN9030 and QN9090 Bluetooth 5 System on Chip (SoC) with optional NFC technology, Multiproof RF technology, and hardware compatible alternatives for 802.15.4 technology. These two happen to be NXP’s recent additions to the ongoing QN series of Bluetooth Low Energy (BLE) devices. These new products will allow the…

Littelfuse, Inc., a global manufacturer of circuit-protection, power control and sensing technologies, has launched the Gate Drive Evaluation Platform (GDEV). The new evaluation platform helps designers evaluate SiC MOSFETs, SiC Schottky diodes, and other peripheral components (such as gate driver circuitry). The aim is to provide designers a better understanding of how silicon carbide technologies…

IBM recently introduced artificial intelligence (AI) into its TRIRIGA solution, allowing facility management and real-estate professionals make the best use of their office space to develop a more engaging workplace experience. IBM’s TRIRIGA is currently one of the most recommended and appreciated Integrated Workplace Management Systems, globally. It features TRIRIGA Building Insights, occupancy data from…

Globally, the installed photovoltaic (PV) solar capacity is growing rapidly. PV systems with a total output of around 600 GW now supply clean and cost-effective electricity – replacing about 600 medium-sized coal-fired power plants. SMA Solar Technology (SMA) and Infineon Technologies support this growth trend with the latest generation of innovative silicon carbide (SiC)-based solar inverters. The…