automotive

Modern vehicles are incomplete without an infotainment system, an automotive computer system with various multimedia features and functions. Infotainment is derived by combining the words “entertainment” and “information,” and these systems deliver both. They’re comprised of an embedded computer system for multimedia, developed to enhance and enrich the overall driving experience. Typically, infotainment systems include…

The Controller Area Network (CAN) is a well-established communication protocol widely recognized for its use in automotive and industrial applications. Developed by Bosch in the 1980s, CAN was specifically designed to support real-time control systems, making it an essential technology in automation. Although newer protocols have emerged, it remains a legacy standard that’s integral to…

A network of sensors is embedded throughout vehicles, serving as a critical type of “nervous system” that detects and measures different automotive parameters. This network is essential for a vehicle’s safety, performance, and efficiency. Several types of sensors are responsible for different roles, such as monitoring the temperature of engine components, the speed of the…

Nexperia, an expert in essential semiconductors, announced an extension to its portfolio of ultra-low capacitance ESD protection diodes designed to protect high-speed data lines in interfaces such as USB, HDMI, high-speed video links, and ethernet in automotive infotainment applications. These latest additions include PESD18VF1BLS-Q, PESD24VF1BLS-Q, PESD30VF1BLS-Q, and PESD32VF1BLS-Q in DFN1006BD-2 package, enabling optical inspection in automotive production lines…

Infineon Technologies announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications. With a small footprint, the new MCUs simplify OEM integration and reduce BOM costs, making them an ideal solution for advanced…

STMicroelectronics’ TSB182 dual-operational amplifier is featured for high-accuracy signal conditioning with sensors, including maximum 20µV input offset voltage, 100nV/° C drift over temperature, and 4V-36V operating range for medium-voltage applications. In addition to its high accuracy, stability, and wide supply-voltage range, the TSB182 is specified from -40° to 125° C. With a maximum offset voltage of…

STMicroelectronics‘ new SPSB081 automotive power-management IC is a Swiss Army Knife of features including a main fixed-voltage low-dropout regulator (LDO), a secondary programmable LDO, four high-side drivers, a CAN FD transceiver, and an optional LIN transceiver. The ICs provide multiple standby modes with very low quiescent current and programmable local or remote wake-up to help…

Texas Instruments (TI) has introduced its new opto-emulator portfolio of signal isolation semiconductors, designed to improve signal integrity, consume less power, and extend the lifetime of high-voltage industrial and automotive applications. TI’s inaugural opto-emulators are pin-to-pin compatible with the industry’s most common optocouplers, enabling seamless integration into existing designs while leveraging the unique benefits of…

Automotive designers are creating new zonal architectures in automotive applications with 10BASE-T1S Ethernet solutions. The 10BASE-T1S technology makes it possible for low-speed devices to connect to a standard Ethernet network, eliminating the need for dedicated communication systems. Expanding its portfolio of automotive-qualified Ethernet solutions, Microchip Technology recently announced a new family of LAN8650/1 MAC-PHY devices qualified…

STMicroelectronics’ TSZ181H1 and dual TSZ182H1 automotive-qualified operational amplifiers (op amps) deliver high accuracy and stability over a wide (-40° to 175° C) temperature range. The high maximum operating temperature encourages use in harsh environments and in applications with long mission profiles. The op amps have very low input offset voltage, typically 3.5µV at 25° Cm, and input bias…

Qualcomm Technologies and Mahindra & Mahindra, a pioneer in the SUV segment in India, announced the companies’ strategic collaboration to use the Snapdragon Digital Chassis Solution cloud-connected services platform — an integrated, flexible services suite for connected cars — for upcoming Mahindra’s range of authentic SUVs. As a key component of the cloud-connected services platform,…

BMW Group and Qualcomm Technologies announced that they have extended their technology collaboration beyond driver assistance and automated driving technologies. The companies are bringing the latest Snapdragon Digital Chassis Solution advancements to power BMW Group’s new vehicles for safer, smarter, and more sophisticated experiences for drivers and passengers. Leveraging both companies’ expertise in innovation, BMW…

Qualcomm Technologies and JLR announced that the companies will work together to bring 5G capabilities to select next-generation JLR vehicles across its brands Range Rover, Defender, Discovery, and Jaguar. As a part of JLR’s efforts in building a sustainability-rich vision of modern luxury by design, the ongoing technology collaboration between Qualcomm Technologies and JLR aims…

Vishay Intertechnology recently introduced five new series of 60, 100, and 150 V surface-mount Trench MOS Barrier Schottky (TMBS) rectifiers in the low-profile DFN3820A package with wettable flanks. Providing space-saving, high-efficiency solutions for commercial, industrial, energy, and automotive applications, the VxNL63, VxNM63, VxN103, VxNM103, and VxNM153 offer: Best-in-class current ratings up to 7 A Current…

Allegro MicroSystems, a global provider in power and sensing solutions for motion control and energy-efficient systems, has announced the launch of its new Power-Thru isolated gate driver. This is the first product introduced in the company’s Power-Thru portfolio. Allegro’s new isolated gate driver creates a single-package solution that drives GaN FETs with up to a…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that its automotive Cyber Security Management System (CSMS) used for the development of microcontrollers (MCU) and system on chips (SoCs) has been defined and implemented according to International Standard ISO/SAE 21434:2021. The CSMS framework applies to Renesas’ design center in Musashi, Japan and has been…

Vehicles with fully or partially electrified drivetrains will account for two-thirds of cars produced by 2028, as per analyst forecasts. This rapid growth of electromobility is driving the demand for power semiconductors. Against this background, Infineon Technologies and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips. Infineon will…

Since relays and fuses cannot meet the requirements of modern E/E vehicle architectures, partial or complete electrification of the primary and secondary power distribution must be taken into account. To address this issue, Infineon Technologies has launched a new generation of ultra-low ohmic high-side switches in a TO-leadless package, the Power PROFET + 12V switch…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced a new development board for automotive gateway systems. The R-Car S4 Starter Kit is a low-cost, readily available development board for building software using the Renesas R-Car S4 system-on-chip (SoC). The SoC delivers high computing performance and an array of communication features for both cloud communication…

The evolving market for automotive event data recorders (EDR) is driving demand for specialized data-logging memory devices that instantly capture and reliably store critical data for decades. To this end, Infineon Technologies has introduced two new Ferroelectric RAM (F-RAM) memory devices in 1Mbit and 4Mbit densities to its EXCELON F-RAM family. The 1Mbit devices are…