Nexperia, an expert in essential semiconductors, has announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include four 650 V, 1 A parts available in CFP3 and CFP5 packages intended for use in onboard chargers (OBC) and inverters for electric vehicles, power converters, PV…
Nexperia surface-mount device passes Board Level Reliability for automotive applications
Nexperia, a semiconductor provider, announced that one of its surface-mount device packages — the clip-bond FlatPower package CFP15B — has passed Board-level Reliability (BLR) testing for automotive applications by a top Tier 1 supplier. Initially, the FlatPower package will be used in an engine-control unit. BLR provides a means of evaluating the reliability of semiconductor…