Vehicles with fully or partially electrified drivetrains will account for two-thirds of cars produced by 2028, as per analyst forecasts. This rapid growth of electromobility is driving the demand for power semiconductors. Against this background, Infineon Technologies and Semikron Danfoss have signed a multi-year volume agreement for the supply of silicon-based electromobility chips. Infineon will…

Infineon Technologies and Hi-Lo Systems, a Taiwan-based IC programming and testing company, announced a partnership to work on Trusted Platform Module (TPM) security chips. Hi-Lo Systems has officially become an Associated Partner of Infineon in the Greater China market and will provide firmware update programming services for Infineon’s OPTIGA TPMs. This will help accelerate time-to-market…

Vishay Intertechnology has introduced a new series of automotive-grade thick-film chip resistors in the compact 2512 case size with high working voltages up to 1415 V. The Vishay Techno CDMA series devices are designed to lower component counts and placement costs for automotive and industrial applications. The reduce PCB sizes, providing increased accuracy and stability.…

Broadcom Inc. has announced the sample availability of its complete end-to-end chipset solutions for the Wi-Fi 7 ecosystem — spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. These Wi-Fi 7 chips more than double the speed of Wi-Fi 6 and 6E solutions on the market today while, simultaneously, delivering reliable low-latency communications…