Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced the RX23W Module with full Bluetooth 5.0 Low Energy support for system control and wireless communication on IoT endpoint devices. Featuring the RX23W 32-bit RX MCU, which supports fully integrated Bluetooth 5.0 Low Energy communication, the new RX23W module is equipped with an antenna,…
John Deere using AI to help solve manufacturing processes
John Deere is leveraging Intel’s artificial intelligence (AI) technology to help solve a costly, age-old problem in the manufacturing welding process. Deere is piloting a solution that uses computer vision to automatically spot common defects in the automated welding process in its manufacturing facilities. “Welding is a complicated process,” said Andy Benko, quality director, John Deere…
TE Connectivity launches new VPX stacking connectors
TE Connectivity (TE), a global provider of connectivity and sensors, has released VPX stacking connectors hat are compliant to the VITA 46 footprint. This connector system allows users to cable off the backplane or plug-in card for rugged, embedded computing applications. Stacking connectors are engineered to perform in environments where small, lightweight, and rugged connectors…
Samsung develops radio technology for 5G deployments in mid-band spectrum
Samsung Electronics has developed a new 5G wideband radio technology that expands bandwidth support for its next-generation radios, including Massive MIMO radios, to help operators drive more flexible and cost-effective 5G deployments. With this new technology, Samsung will extend the bandwidth support of its 5G radios to 400MHz — double the 200MHz supported by its…
CUI adds to its high-density, quarter-brick, dc-dc series
CUI Inc., a Bel group company, recently announced the addition of two 75 and 100-watt, high-density, quarter-brick dc-dc series to its isolated dc-dc converter line. These new compact products use the latest technology, allowing for a much smaller footprint while maintaining high-operating efficiency — of up to 94 percent. The converters are also designed to…
Renesas offers highly integrated motor-control ICs
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its motor-control solutions portfolio with two system-in-package (SiP) solutions to simplify brushless DC (BLDC) motor-control design for a wide range of cordless battery-powered applications — such as power tools, drones, water pumps, vacuums, cleaning robots, fans, and other systems. By combining multiple functions into…
Molex unveils accelerometer-based, automotive noise-cancelling sensor
Molex, a global connectivity and electronics solutions provider, has introduced an accelerometer-based, Road Noise Cancelling (RNC) sensor, the first product in a new family of automotive Active Noise Cancellation (ANC) sensors. These sensors will play a critical role in combatting unwanted road, wind and HVAC car noise while reducing low-frequency sounds that increase driver fatigue.…
AVX expands its TCQ Series automotive conductive polymer chip capacitors
AVX Corporation— a manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions — has both expanded and improved upon its AEC-Q200-qualified TCQ Series Automotive Conductive Polymer Chip Capacitors. They have been field-proven in a wide range of demanding automotive, industrial, and telecommunications applications with limited board space and challenging operating…
Diodes offers new synchronous buck converter with wide-input voltage range
Diodes Incorporated new AP61300/AP61302 is a 3A, synchronous buck converter with a wide input voltage range between 2.4 and 5.5V. The device fully integrates a 70mΩ high-side power MOSFET and a 50mΩ lowside power MOSFET to provide high-efficiency step-down DC-DC conversion. The AP61300/AP61302 can be set to operate in either pulse-width modulation (PWM), regardless of…
Renesas launches power and functional safety solution for R-Car V3H SoC
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced a new power and functional safety solution for systems based on the R-Car V3H system-on-chip (SoC) for advanced driver-assistance (ADAS), automotive front cameras and driver monitor cameras. The new solution includes the RAA271050, a 42V synchronous, buck pre-regulator that accepts the vehicle’s 12V supply…
Diodes offers new packet switch for design flexibility and power savings
Diodes Incorporated recently introduced the PI7C9X3G808GP, a PCIe 3.0 packet switch that’s capable of delivering the elevated performance parameters mandated by modern data center, cloud computing, network-attached storage (NAS), and telecom infrastructure implementations. This new packet switch supports 8-lane operation, accommodating 2, 3, 4, 5, and 8-port configurations. Cut-through, store, and forward modes can all…
Samsung initiates KDDI’s 5G rollout on 700MHz
Samsung Electronics is bringing its advanced 700MHz solutions on-air for the KDDI’s commercial launch of 5G. The use of 700MHz spectrum in this rollout will enhance KDDI’s 5G network coverage, improve indoor and outdoor mobile experiences, and provide reliable 5G connectivity to users. This low-band 5G network is a significant addition to KDDI’s existing 5G…
Renesas expands its RA6 Series MCUs, offering more communication options
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its RA6 Series microcontrollers (MCUs) with 20 new RA6M5 Group MCUs, completing the mainstream line of RA6 Series devices. The new parts offer a wide array of communications options, generous on-chip memory, and Renesas’ best-in-class security features, enabling customers to create innovative IoT designs.…
Analog Devices launches radio platform for 5G O-RAN ecosystem
Analog Devices, Inc. has announced an ASIC-based radio platform for O-RAN compliant 5G radio units that’s designed to shorten time to market and meet the evolving needs of 5G networks. The O-RAN ecosystem uses open standards to disaggregate the traditional network and allow greater flexibility and additional features across carrier networks. ADI’s radio platform includes…
Qualcomm launches Snapdragon 888 5G mobile platform
Qualcomm‘s latest flagship 8 series 5G platform transforms devices into a professional-quality camera, intelligent personal assistant, and elite gaming rig — which are all connected with a truly global 5G multi-gigabit speeds for a premium experience. The Qualcomm Snapdragon 888 5G Mobile Platform packs new innovations in 5G, AI, gaming, photography, and more. Featuring a…
New Intel AI-powered backpack helps visually impaired navigate world
Artificial intelligence (AI) developer, Jagadish K. Mahendran, and his team have designed an AI-powered, voice-activated backpack that can help the visually impaired navigate and perceive the world around them. The backpack helps detect common challenges such as traffic signs, hanging obstacles, crosswalks, moving objects and changing elevations, all while running on a low-power, interactive device.…
Vishay launches new hyper and ultra-fast rectifiers
Vishay Intertechnology, Inc. has introduced 10 new FRED Pt Gen 5 600 V Hyperfast and Ultrafast rectifiers — offering the best reverse recovery performance for devices in their class. The 15 A, 30 A, 60 A, and 75 A rectifiers are designed to increase the efficiency of AC/DC and DC/DC converters and of hard and…
STMicroelectronics and QQmented partner to support AR & 3D-sensing markets
STMicroelectronics, a global semiconductor provider, and OQmented, a deep-tech startup focused on MEMS-mirror technology, have agreed to collaborate on the advancement of the technology for the augmented reality and 3D-sensing markets. The joint effort aims to build on the expertise of both companies to advance the technology and products behind the leading MEMS1-mirror-based, laser-beam scanning (LBS)…
Trinamic introduces two new sets of embedded motion-control modules
TRINAMIC Motion Control GmbH & Co. KG, now part of Maxim Integrated Products, recently introduced two new sets of slot type, embedded motion-control modules, and development tools that feature a unique, real-time, sensor-free control technology. These complete controller/driver modules keep the motor control system’s communications traffic low by processing real-time critical functions on-board and offloading…
Harwin offers new metal backshell shielding options
To provide comprehensive EMI/RFI protection across horizontal and vertical planes, Harwin has added new additions to its metal backshell shielding options. The company now offers backshells for its horizontal Datamate J-Tek connectors, which address increasingly commonplace right-angle interconnect orientations. These backshells mate directly with the cabling metal backshells that Harwin already has for its female…