STMicroelectronics has extended support for Microsoft Azure RTOS in the STM32Cube development environment — covering additional high performance, mainstream, ultra-low-power and wireless microcontrollers (MCUs) from the STM32 family. Users can leverage the qualities of Azure RTOS, the convenience of STM32Cube, and the flexibility of the STM32 family to optimize MCU properties, now choosing from more than…
Vishay offers new miniature position sensor
Vishay Intertechnology has introduced a new miniature position sensor with a small 12.7 mm outer diameter that delivers higher accuracy and resolution than competing devices in the same size — offering increased reliability and durability for the harsh operating environments of military and industrial applications. The Vishay MCB RAME012 rotational absolute magnetic encoder uses advanced…
Infineon launches first space-qualified, serial-interface F-RAM
Infineon Technologies announced the availability of the space industry’s first radiation-hardened (rad-hard), serial -nterface Ferroelectric RAM (F-RAM) for extreme environments. The new devices deliver unsurpassed reliability and data retention and are more energy efficient than non-volatile EEPROM and serial NOR Flash devices for space applications. The addition of a QML-V qualified F-RAM to Infineon’s memory…
Vishay adds to its series of automotive-grade, glass-protected NTC thermistors
Vishay Intertechnology announced that it has extended its NTCS0603E3…..T and NTCS0805E3…..T series of automotive-grade, glass-protected NTC thermistors in the 0603 and 0805 case sizes with new electrical-resistance values at +25° C (R25). The AEC-Q200-qualified devices are now available with lower R25 values of 1 and 1.5 kW, in addition to a new 5 kW value…
Infineon extends CoolSiC M1H technology portfolio with 1200 V SiC MOSFETs
Infineon Technologies has introduced a new CoolSiC technology to its lineup: the CoolSiC MOSFET 1200 V M1H. This advanced silicon-carbide (SiC) chip will be implemented in a widely extended portfolio using the popular Easy Module family — with discrete packages using .XT interconnect technology. The M1H chip offers high flexibility and is suitable for solar…
Renesas offers industry’s first PCIe Gen6 clock buffers and multiplexers
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced the first clock buffers and multiplexers that meet stringent PCIe Gen6 specifications. The company is offering 11 new clock buffers and four new multiplexers. These new devices, which also support and provide extra margin for PCIe Gen5 implementations, complement Renesas’ low-jitter 9SQ440, 9FGV1002 and…
Wacom Active ES Pens integrate Renesas’ wireless power-charging technology
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced that its wireless power-charging technology is integrated in the Active ES pen solutions from Wacom. Renesas’ single-chip, wireless power-receiver IC delivers a small size and high efficiency when compared to alternative high-frequency charging solutions. The charging technology is small enough to fit into digital…
New semiconductor collaboration to advance next-generation FD-SOI roadmap
CEA, Soitec, GlobalFoundries, and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology. “ST was an early innovator in FD-SOI and has been in production for several years, with both custom and standard advanced products for a broad range of end-markets,”…
Renesas launches virtual environment for automotive software development
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has launched a virtual development environment that enables advance development and operational evaluation of automotive application software to support the latest requirements of electrical/electronic architecture (E/E architecture). The environment includes a Virtual Turnkey Platform, which allows engineers to develop application software before devices or evaluation boards…
STMicroelectronics’ new automotive amplifier supports high-definition audio
STMicroelectronics’ TDA7901 automotive amplifier integrates a buck controller for class-G power switching and supports high-definition audio — a market-unique combination for ideal listening and high efficiency. In class-G operation, the TDA7901 buck controller automatically optimizes the voltage supplied to the bridge-tied load (BTL) power-stage, depending on the audio-signal level. The resulting smooth, analog sound comes with…
The Snapdragon Pro series has arrived
Brought to you by ESL Gaming and Qualcomm Technologies, the Snapdragon Pro Series welcomes players and fans to the “Era of Everyone.” Both aspiring mobile gamers and veteran esports athletes from around the world are invited to compete in the three tiers of competition: Snapdragon Mobile Open, Snapdragon Mobile Challenge, and Snapdragon Mobile Masters. “The…
Infineon launches power-management solutions for Intel Xeon processors
Infineon Technologies has announced the launch of a complete power-management offering for compute servers, based on Intel’s Sapphire Rapids compute-processing units (CPU). This new “pick-and-place” solution uses several Infineon power-management devices and technologies that deliver optimum power efficiency and performance — including XDP digital multiphase controllers, OptiMOS integrated power stages and OptiMOS IPOL voltage regulator. This offering…
New shielding options available for Harwin’s Gecko Hi-Rel connectors
Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously, Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations. This new development will be of real value to applications requiring EMI/RFI protection, but where there’s…
STMicroelectronics’ automotive gate driver boosts motor-control flexibility
STMicroelectronics’ L9908 automotive, three-phase, gate-driver unit (GDU) operates in 12, 24, or 48V systems and has flexible input and output channels to fulfill several applications in conventional and hybrid/electric vehicles. Dedicated source connections to the high-side and low-side FETs (field-effect transistors) of each half bridge let users configure the output channels independently to drive various types…
Microchip enables Qi 1.3 wireless charging with authentication
To ensure high-quality, wireless-charging power transmitters, the Wireless Power Consortium (WPC) has released the Qi 1.3 specification with the extended power profile. This new specification created demand for high-security, silicon-authentication devices for full-service support. In response, Microchip Technology is announcing the new, industrial-grade TrustFLEX ECC608 and the automotive-grade Trust Anchor TA100. This is combined with…
Renesas incorporates solutions from Celeno for 10 new winning combinations
Renesas Electronics Corporation announced 10 new winning combinations that combine Wi-Fi 6 and 6E chipsets from recently acquired Celeno Communications — with a broad range of solutions from Renesas including embedded processing, analog, power, timing and connectivity. The new winning combos include solutions for IoT, Industrial, Infrastructure, and other applications. Renesas’ combinations are engineering-vetted designs…
STMicroelectronics’ AMOLED power-management IC boosts viewing experience
STMicroelectronics’ new, fully integrated Power-Management IC (PMIC) for AMOLED displays combines a low quiescent current and enhanced flexibility to extend the battery runtime of portable devices. With an input-voltage range from 2.9 to 4.8V, the STMP30 PMIC contains three integrated DC-DC converters to provide all the power rails needed for AMOLED displays in smartphones and other…
TI addresses power-management design challenges for EVs and industrial applications
Texas Instruments (TI) demonstrated at the Applied Power Electronics Conference (APEC) last week, focused on how engineers can overcome some of their most pressing power-management design challenges. The company showcased the newest additions to its power-management portfolio and demonstrate system-level solutions for increasing power density, reducing electromagnetic interference (EMI), noise, and quiescent current (IQ), and…
New meter-level location accuracy available for Android smartphones
Trimble and Qualcomm Technologies have announced the availability of Trimble RTX GNSS technology for the Snapdragon 8 Gen 1 and Snapdragon 888 Mobile Platforms. This technology enables superior location capabilities in premium Android smartphones worldwide. The integration of Trimble RTX GNSS technology, a correction services platform, with Snapdragon contributes to a higher quality, more accurate…
Vishay adds to its TNPV e3 series of thin-film, flat-chip resistors
Vishay Intertechnology has announced that it has extended its TNPV e3 series of automotive-grade, high-voltage, thin-film, flat-chip resistors with a smaller 0805 case size. The Vishay Draloric TNPV0805 e3 is the industry’s first such device in the compact 0805 case size to combine high-operating voltages to 450 V with tight tolerance of ± 0.1 %…