Waking up isn’t always easy, especially when the snooze button is typically only a short reach away. Overcoming the desire to stay in the comfort of our beds often requires an understanding of intrinsic motivation. But we have a solution that requires one simple device — a smart mat. In this project, we’ll design a…

Bluetooth, which offers short-range wireless technology, is now standard on most smart devices, including wireless headphones, smart watches, remote controls, game controllers, and many more. Most of these devices are designed to operate with smartphones or computers.  Audio streaming, file sharing, peripheral devices, the Internet of Things (IoT), and smart home devices are some common…

In today’s digital world, machine-to-machine (M2M) is quickly becoming standard. M2M includes any technology that enables networked devices to exchange data or information. It can be wired or wireless, but the Internet of things (IoT) has made such wireless communication between devices commonplace. The interconnected of things has also made these devices intelligent. Consider how…

Electronics makers often build mobile apps to control electronic devices. These are typically WiFi or Bluetooth-connected devices controlled by a smartphone. Several software frameworks and tools support the development of native or cross-platform mobile apps for iOS and Android. Some popular frameworks include React Native, Flutter, Xamarin, Swiftic, Ionic, Apache Cordova, Jquery Mobile, and Native…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced that it has produced its first microcontroller (MCU) based on advanced 22-nm process technology. By employing state-of-the-art process technology, Renesas can provide customers with superior performance at lower power consumption driven by reduced core voltages. The advanced process technology also offers the ability to integrate…

Infineon Technologies announced its AIROC CYW20829 Bluetooth LE system on chip (SoC) is ready with the newly released Bluetooth 5.4 specification. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth…

The new STM32 Bluetooth wireless module from STMicroelectronics lets designers access the advantages of ST’s dual-core STM32WB microcontrollers (MCUs), especially in projects intended for low-to-medium production volumes. The module simplifies development and accelerates time to market, combining Bluetooth Low Energy 5.3 certification and worldwide radio-equipment approvals with the STM32Cube ecosystem support. The all-in-one STM32WB1MMC module alleviates…

Infineon Technologies has announced the new AIROC CYW43022 ultra-low power, dual-band Wi-Fi 5 and Bluetooth combo, extending its broad portfolio of existing Wi-Fi and Bluetooth products. The CYW43022 ultra-low power architecture delivers industry-leading performance, with up to a 65% reduction in power usage during “deep sleep,” significantly extending battery life for applications such as smart…

STMicroelectronics has extended its range of single-chip antenna-matching ICs that simplify RF-circuit design with two new devices optimized for BlueNRG-LPS system-on-chip ICs (SoCs) and STM32WB1x and STM32WB5x wireless microcontrollers. The MLPF-NRG-01D3 for BlueNRG-LPS and MLPF-WB-02D3 for STM32WB integrate the complete filtering and impedance-matching network needed for the best RF output power and receiver sensitivity with an external antenna. Each has 50Ω nominal…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth Low-Energy (LE) and IEEE 802.15.4 (Thread) products — including products from recently acquired Dialog Semiconductor and Celeno Communications. The…

When designing portable and battery-powered audio devices for consumer speaker applications, maximizing battery playback time and maintaining excellent audio performance in a compact form and at a low-system cost is essential. MERUS multilevel switching technology from Infineon Technologies is designed to achieve low switching losses and highly efficient amplification at both low and high output…

Qualcomm Technologies, Inc. announced that its flagship Snapdragon 8+ Gen 1 Mobile Platform is powering Samsung Electronics’ latest foldable smartphones, the Samsung Galaxy Z Fold4 and Galaxy Z Flip4. The company’s newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering performance enhancements for a boost across all on-device experiences. The new Galaxy Z series…

STMicroelectronics has introduced its third-generation Bluetooth System-on-Chip (SoC), enhanced with Bluetooth direction-finding technology for location-tracking and real-time positioning applications. By determining the direction of a Bluetooth Low Energy (BLE) signal, the Bluetooth 5.3 certified BlueNRG-LPS SoC can precisely estimate movement and location with centimetre accuracy. It uses Bluetooth-specified technology including angle-of-arrival (AoA) and angle-of-departure (AoD), as…

Texas Instruments (TI) has expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is built on the foundation of TI’s decades of wireless connectivity expertise.…

Renesas Electronics Corporation announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions ― the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE…

Infineon Technologies is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system-on-chip (SoC) to its AIROC Bluetooth Portfolio. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is a Bluetooth 5.2 core spec-compliant device tailor-made for IoT applications. It is designed to support a wide spectrum of use cases for home automation and sensors…

New common-mode filters from STMicroelectronics have an extremely wide differential bandwidth of 10.7GHz to protect antenna sensitivity in adjacent wireless circuitry from the latest serial digital interfaces. The 2-channel ECMF2-40A100N10 and 4-channel ECMF4-40A100N10 are compatible with high-speed interface standards including USB 3.2 Gen 2, USB4, HDMI 2.1, and DisplayPort. With their low serial resistance of just 3Ω,…

MediaTek has launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology — connectivity, displays, gaming, as well as multimedia and imaging features — to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek’s powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which…

Infineon Technologies is launching the AIROC CYW20829 Bluetooth LE system on chip (SoC). The AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device for IoT, smart home, and industrial applications. With the right combination of low power and high performance, AIROC CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy…

NXP Semiconductors has announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2, and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive, and industrial use-cases. It also supports the new groundbreaking Matter connectivity protocol. The IW612…