ESP-NOW is a connection-less wireless communication protocol by Espressif, a company that developed the popular Wi-Fi development boards ESP8266 and ESP32. This low-power 2.4 GHz wireless communication protocol allows two paired ESP boards to communicate without a router or Wi-Fi. ESP-NOW communicates in small packets of data within a few hundred meters. This connection remains…
How to choose the ideal connectivity technology for an IoT project
Many communication technologies are currently available, making choosing one for an Internet-of-Things project potentially daunting. For example, several LP-WAN options exist, including Wi-Fi, Ethernet, LoRa, Zigbee, Bluetooth, and cellular technologies like NB-IoT, LTE-M, and 5G. Every connectivity solution has pros and cons, and there isn’t one ideal for all projects. Wi-Fi might seem like the…
What is Matter? An all-new smart home standard
Smart home automation is continuously evolving. It’s an emerging segment that has attracted the attention of big tech conglomerates like Apple, Google, and Amazon. However, interoperability has been a significant challenge in smart home installation since its inception. The focus so far has been on integrating a myriad of devices, platforms, and services under a…
BMW to integrate Snapdragon Digital Chassis
BMW Group and Qualcomm Technologies announced that they have extended their technology collaboration beyond driver assistance and automated driving technologies. The companies are bringing the latest Snapdragon Digital Chassis Solution advancements to power BMW Group’s new vehicles for safer, smarter, and more sophisticated experiences for drivers and passengers. Leveraging both companies’ expertise in innovation, BMW…
Qualcomm launches new Snapdragon 4 Gen 2 mobile platform
Qualcomm Technologies has announced the new Snapdragon 4 Gen 2 mobile platform, which has been creatively engineered to make incredible mobile experiences accessible to more consumers globally. Snapdragon 4 Gen 2 provides effortless, all-day use with fast CPU speeds, sharp photography, videography, and speedy 5G and Wi-Fi for reliable connections. “Snapdragon – at its core…
Rohde & Schwarz and Qualcomm to test 3GPP Rel. 17 GSO & GEO satellite chipsets
Rohde & Schwarz in collaboration with Qualcomm Technologies, will conduct a comprehensive set of tests for NB-IoT over non-terrestrial networks (NTN) to accurately verify two-way Internet-of-things (IoT) data across various operating modes using GSO and GEO constellations in line with the 3GPP Release 17. At the MWC Shanghai 2023, Rohde & Schwarz will hold a…
STMicroelectronics to exhibit IoT, power, connectivity & more at MWC Shanghai 2023
STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, will exhibit at MWC Shanghai 2023 (Booth N1.D85) on June 28-30th. Featuring more than 30 demonstrations from ST and its ecosystem partners and five presentations, ST will showcase its products and solutions for Smart Mobility, Power & Energy, and the Internet of…
Keysight makes UK’s first 100Gbps 6G sub-THz connection
Keysight Technologies, Inc., in collaboration with the National Physical Laboratory (NPL) and the University of Surrey, has made the first 6G connection at speeds greater than 100 gigabits per second (Gbps) over sub-terahertz (THz) frequencies in the U.K. Future 6G use cases, such as augmented reality and autonomous vehicles, will require data throughput speeds from…
STMicroelectronics launches ultra-compact NB-IoT industrial modules
STMicroelectronics ST87M01 ultra-compact and low-power modules combine highly reliable NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets. The fully programmable, certified LTE Cat NB2 NB-IoT industrial modules cover worldwide cellular frequency bands and integrate advanced security features. As one of the first IoT cellular products worldwide offered in accordance…
Renesas launches Wi-Fi development kit with support for Matter protocol
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth Low-Energy (LE) and IEEE 802.15.4 (Thread) products — including products from recently acquired Dialog Semiconductor and Celeno Communications. The…
Renesas expands low-power WAN product line with NB-IoT capability
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices, and industrial applications. The new RYZ024A supports Cat-M1 and NB-IoT (Narrowband Internet of Things) internet connectivity without the need for a gateway…
TI unifies IoT ecosystems with Matter-enabled wireless MCU software
Enabling smarter connections to the world around us, Texas Instruments (TI) has introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline the adoption of the Matter protocol in the Internet of Things (IoT) applications. The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in…
STMicroelectronics expands its 5V op-amp line for high-accuracy signal conditioning
STMicroelectronics has added the TSV782 high-performance dual op-amp to its 5V family, with 30MHz gain bandwidth (GBW) and 50µV (typical) input offset voltage for high-speed, high-accuracy signal conditioning. With the ability to function with a supply as low as 2.0V, the TSV782 can operate from a deeply discharged battery and so extend the runtime of equipment such…
Broadcom ships Tomahawk 5, industry’s highest bandwidth switch chip
Broadcom‘s StrataXGS Tomahawk 5 switch series, provides 51.2 Terabits/sec of Ethernet switching capacity in a single, monolithic device, which is double the bandwidth of other available switch silicons. “Delivering the world’s first 51.2 Tbps switch two years after we released Tomahawk 4, the industry’s first 25 Tbps switch, is a testament to the outstanding execution…
Snapdragon 8+ Gen 1 now powers Samsung Galaxy Z devices
Qualcomm Technologies, Inc. announced that its flagship Snapdragon 8+ Gen 1 Mobile Platform is powering Samsung Electronics’ latest foldable smartphones, the Samsung Galaxy Z Fold4 and Galaxy Z Flip4. The company’s newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering performance enhancements for a boost across all on-device experiences. The new Galaxy Z series…
STMicroelectronics offers multi-connectivity development kit for asset tracking
The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building a complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit also includes firmware to simplify the development of targeted applications, such as livestock monitoring, fleet management, and logistics. The kit helps users evaluate ST’s industry-first short and…
How to use MicroPython with ESP8266 and ESP32 to connect to a WiFi network
ESP8266 and ESP32 are popular WiFi development boards. These single-board microcontrollers are supported by the MicroPython framework and are often used for the internet of things (IoT). Using MicroPython, ESP8266 and ESP32 can connect to the internet via WiFi and Ethernet. The MicroPython ports use Ethernet or the wireless local area network (WLAN). In this…
Nexperia’s new level translators support legacy and future mobile SIM cards
Nexperia, an expert in essential semiconductors, announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next-generation, low-voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards. As processor geometries advance to single-digit nanometer nodes, the core voltage of advanced SoCs is…
TI offering wireless microcontrollers that enable high-quality Bluetooth LE
Texas Instruments (TI) has expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is built on the foundation of TI’s decades of wireless connectivity expertise.…
Renesas launches highly advanced and integrated Bluetooth Low Energy SoC
Renesas Electronics Corporation announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions ― the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE…