Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth Low-Energy (LE) and IEEE 802.15.4 (Thread) products — including products from recently acquired Dialog Semiconductor and Celeno Communications. The…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its low-power WAN product line as part of its strategy to deliver connectivity devices used for smart cities, smart homes, medical devices, and industrial applications. The new RYZ024A supports Cat-M1 and NB-IoT (Narrowband Internet of Things) internet connectivity without the need for a gateway…

Enabling smarter connections to the world around us, Texas Instruments (TI) has introduced new Matter-enabled software development kits for Wi-Fi and Thread SimpleLink wireless microcontrollers (MCUs) that will streamline the adoption of the Matter protocol in the Internet of Things (IoT) applications. The software builds on TI’s close involvement with the Connectivity Standards Alliance and innovation in…

STMicroelectronics has added the TSV782 high-performance dual op-amp to its 5V family, with 30MHz gain bandwidth (GBW) and 50µV (typical) input offset voltage for high-speed, high-accuracy signal conditioning. With the ability to function with a supply as low as 2.0V, the TSV782 can operate from a deeply discharged battery and so extend the runtime of equipment such…

Broadcom‘s StrataXGS Tomahawk 5 switch series, provides 51.2 Terabits/sec of Ethernet switching capacity in a single, monolithic device, which is double the bandwidth of other available switch silicons. “Delivering the world’s first 51.2 Tbps switch two years after we released Tomahawk 4, the industry’s first 25 Tbps switch, is a testament to the outstanding execution…

Qualcomm Technologies, Inc. announced that its flagship Snapdragon 8+ Gen 1 Mobile Platform is powering Samsung Electronics’ latest foldable smartphones, the Samsung Galaxy Z Fold4 and Galaxy Z Flip4. The company’s newest flagship platform, Snapdragon 8+, is a premium-tier powerhouse delivering performance enhancements for a boost across all on-device experiences. The new Galaxy Z series…

The STEVAL-ASTRA1B multi-connectivity evaluation platform from STMicroelectronics provides a complete ecosystem for building a complete proof-of-concept for asset tracking systems. Battery-powered, and with a small form factor, the evaluation kit also includes firmware to simplify the development of targeted applications, such as livestock monitoring, fleet management, and logistics. The kit helps users evaluate ST’s industry-first short and…

ESP8266 and ESP32 are popular WiFi development boards. These single-board microcontrollers are supported by the MicroPython framework and are often used for the internet of things (IoT). Using MicroPython, ESP8266 and ESP32 can connect to the internet via WiFi and Ethernet. The MicroPython ports use Ethernet or the wireless local area network (WLAN). In this…

Nexperia, an expert in essential semiconductors, announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next-generation, low-voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards. As processor geometries advance to single-digit nanometer nodes, the core voltage of advanced SoCs is…

Texas Instruments (TI) has expanded its connectivity portfolio with a new family of wireless microcontrollers (MCU) that enable high-quality Bluetooth Low Energy (LE) at half the price of competing devices. Featuring best-in-class standby current and radio-frequency (RF) performance, the SimpleLink Bluetooth LE CC2340 family is built on the foundation of TI’s decades of wireless connectivity expertise.…

Renesas Electronics Corporation announced the SmartBond DA1470x Family of Bluetooth low energy (LE) solutions ― the world’s most advanced, integrated System-on-Chip (SoC) family for wireless connectivity. The DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs). The cloud kits are the first to be equipped with Renesas’ RYZ014A Cat-M1 module, a certified LTE cellular module that offers…

Infineon Technologies is adding the AIROC CYW20820 Bluetooth & Bluetooth LE (low energy) system-on-chip (SoC) to its AIROC Bluetooth Portfolio. The AIROC CYW20820 Bluetooth & Bluetooth LE SoC is a Bluetooth 5.2 core spec-compliant device tailor-made for IoT applications. It is designed to support a wide spectrum of use cases for home automation and sensors…

Infineon Technologies has announced plans to highlight how the company links the real to the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. This is a prerequisite for unlocking the potential of IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart…

Trimble and Qualcomm Technologies have announced the availability of Trimble RTX GNSS technology for the Snapdragon 8 Gen 1 and Snapdragon 888 Mobile Platforms. This technology enables superior location capabilities in premium Android smartphones worldwide. The integration of Trimble RTX GNSS technology, a correction services platform, with Snapdragon contributes to a higher quality, more accurate…

TE Connectivity (TE), a provider of connectivity and sensors, has launched a new series of V0 cable cleats that improves cable management and protection in a wide range of applications — including wind farms, substations, data centers, rail & metro, and more. As energy demand grows, so does the complexity of cable systems. Absent or unreliable cable-management solutions can…

Qualcomm Technologies has announced the Snapdragon X70 5G Modem-RF System, its 5th generation modem-to-antenna 5G solution. Snapdragon X70 introduces the world’s first 5G AI processor in a modem-RF system, to harness the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads — offering fast upload speeds, low latency, coverage, and power efficiency.…

NXP Semiconductors has announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2, and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive, and industrial use-cases. It also supports the new groundbreaking Matter connectivity protocol. The IW612…

Digi-Key Electronics, which offers one of the world’s largest selection of electronic components, has partnered with Seeed Studio and Machinechat to launch the industry’s first private LoRaWAN-in-a-Box solutions for the Internet of Things (IoT). “Digi-Key is proud to be the exclusive global source for these turn-key, industry-first LoRaWAN solutions,” said Robbie Paul, director of IoT business solutions at Digi-Key. “Wireless…

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced a new Group of 32-bit microcontrollers (MCUs) in its RA Family. The new RA6E1 MCUs, based on the Arm Cortex-M33 core, are the industry’s first Entry-Line MCUs to deliver 200 MHz performance. The new devices also provide exceptional low power consumption specifications, along with…