STMicroelectronics, a global semiconductor provider, has released its third generation of MEMS sensors. The new sensors enable the next leap in performance and features for consumer mobiles and smart industries, healthcare, and retail. MEMS technology is the cornerstone of the chip-sized motion and environmental sensors that drive the intuitive context-aware features of today’s smartphones and…
STMicroelectronics combines signal processing and AI algorithms onto MEMS sensors
STMicroelectronics, a global semiconductor provider and a top manufacturer of Micro-Electro-Mechanical Systems (MEMS), has announced the launch of the Intelligent Sensor Processing Unit (ISPU), which combines a digital signal processor (DSP) suited to run AI algorithms and MEMS sensor on the same silicon. In addition to reducing size over system-in-package devices and cutting power by up…
STMicroelectronics and Politecnico di Milano partner on R&D center for sensors
STMicroelectronics, a global semiconductor provider, and Politecnico di Milano, a scientific-technological university that trains engineers, architects, and industrial designers, have committed to a five-year collaboration agreement. The announcement was made in the presence of Italy’s Minister of Economic Development Giancarlo Giorgetti. At the heart of the agreement is the establishment of a joint research center…
Micro-Electro-Mechanical Systems (MEMS)
Micro-Electro-Mechanical Systems or MEMS is a precision device technology that integrates mechanical elements, sensors, actuators, and electronics on a common silicon substrate through micro fabrication technology. MEMS is also referred to as MST (Microsystems Technology in Europe) and MM (Micromachines in Japan). MEMS with optics is called MOEMS- Micro-Opto-Electro-Mechanical-Systems). ICs can be thought of as the “brains” of a system and MEMS augments it with the “Senses” and “Limbs”. While the electronics are fabricated using integrated circuit (IC) batch processing techniques, MEMS uses compatible “micromachining” processes, in addition to IC fabrication processes, that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices. These systems can sense, control and actuate on microscale, and function individually or in arrays to generate effects on macroscale.