STMicroelectronics, a global semiconductor provider serving customers across the spectrum of electronics applications, has introduced the market’s first MEMS water/liquid-proof absolute pressure sensor with a declared 10-year longevity program for the industrial market. “With the spread of the Industrial Internet of Things, companies are seeking to gather data from throughout their operations, often in challenging…
STMicroelectronics introduces automotive inertial module with certified ASIL B software library
The STMicroelectronics ASM330LHB automotive-qualified MEMS inertial-sensing module provides accurate measurements for a variety of vehicle functions and, with the dedicated software provided, addresses functional-safety applications up to ASIL B. The module contains a 3-axis digital accelerometer and 3-axis digital gyroscope, designed for a lifetime on the road, and provides a six-channel synchronized output. Its high-accuracy inertial…
Infineon introduces high-performance XENSIV MEMS microphones
Infineon Technologies is launching its next-generation XENSIV MEMS microphones that define a new industry standard. The microphones IM69D127, IM73A135, and IM72D128 are the latest additions to Infineon’s growing microphone portfolio. Combined with selectable power modes the MEMS microphones are a perfect match for consumer electronics such as headphones with active noise cancellation, TWS earbuds, conference devices with…
STMicroelectronics releases first automotive IMU with embedded machine learning
STMicroelectronics’ ASM330LHHX inertial measurement unit (IMU) moves smart driving another step closer to high levels of automation with its machine-learning (ML) core. The ML core enables fast real-time response and sophisticated functions with low system-power demand. Leveraging ST’s micro-electro-mechanical systems (MEMS) technology, the automotive-qualified ASM330LHHX houses a 3-axis accelerometer and 3-axis gyroscope in a 2.5 x 3…
STMicroelectronics’ new MEMS sensors advance performance of smart devices
STMicroelectronics, a global semiconductor provider, has released its third generation of MEMS sensors. The new sensors enable the next leap in performance and features for consumer mobiles and smart industries, healthcare, and retail. MEMS technology is the cornerstone of the chip-sized motion and environmental sensors that drive the intuitive context-aware features of today’s smartphones and…
STMicroelectronics combines signal processing and AI algorithms onto MEMS sensors
STMicroelectronics, a global semiconductor provider and a top manufacturer of Micro-Electro-Mechanical Systems (MEMS), has announced the launch of the Intelligent Sensor Processing Unit (ISPU), which combines a digital signal processor (DSP) suited to run AI algorithms and MEMS sensor on the same silicon. In addition to reducing size over system-in-package devices and cutting power by up…
STMicroelectronics and Politecnico di Milano partner on R&D center for sensors
STMicroelectronics, a global semiconductor provider, and Politecnico di Milano, a scientific-technological university that trains engineers, architects, and industrial designers, have committed to a five-year collaboration agreement. The announcement was made in the presence of Italy’s Minister of Economic Development Giancarlo Giorgetti. At the heart of the agreement is the establishment of a joint research center…
Micro-Electro-Mechanical Systems (MEMS)
Micro-Electro-Mechanical Systems or MEMS is a precision device technology that integrates mechanical elements, sensors, actuators, and electronics on a common silicon substrate through micro fabrication technology. MEMS is also referred to as MST (Microsystems Technology in Europe) and MM (Micromachines in Japan). MEMS with optics is called MOEMS- Micro-Opto-Electro-Mechanical-Systems). ICs can be thought of as the “brains” of a system and MEMS augments it with the “Senses” and “Limbs”. While the electronics are fabricated using integrated circuit (IC) batch processing techniques, MEMS uses compatible “micromachining” processes, in addition to IC fabrication processes, that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices. These systems can sense, control and actuate on microscale, and function individually or in arrays to generate effects on macroscale.