Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has introduced a family of the SpiStack memories. This new SpiStack W25M series enables the Stacking of homogeneous or heterogeneous flash. This feature provides a better flash solution to the designers for their design requirements. The W25M SpiStack is well developed with 8 pin package (this package is most familiar for the designers) and provides a wide range of densities, multi-IO SpiFlash interface and command set.
Heterogeneous and homogeneous stacking memories are the absolute method of creating a best memory solution. The SpiStack architecture will provide maximum flexibility for the designers to meet their specific memory-density and application requirements while modifying the flash solutions.
The SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory. And the SpiStack heterogeneous memories are achieved by stacking a NAND die with a NOR memory. For example 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die. So, the designer can store code in the NOR die and data in the NAND memory.
Highlights of SpiStack
Multiple SpiFlash dies
Each die has the density ranges from 16Mb to 2Gb and they can be stacked with any combination of NOR and NAND dies.
Each die can be used according to its characteristics
A NOR die can be used to store the boot code because of its cell characteristics which deliver better endurance and retention, and fast random access time.
A NAND memory can be used to store data and/or to back up the boot code. It improves the system quality by storing up-to-date code residing in the working memory for later usage.
The SpiStack supports concurrent operation, so the code execution is not interrupted for any data updates.
Benefits of additional software like C2h
All SpiStack features are supported in an 8-pin package along with the standard QSPI command, so that backward compatibility is conserved. The dies are stacked based on Winbond’s unique stacking process technology.
Winbond SpiStack flash memory solutions are available now and its large volume production is starting from 2Q’2016.
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