Engineers Garage

  • Electronic Projects & Tutorials
    • Electronic Projects
      • Arduino Projects
      • AVR
      • Raspberry pi
      • ESP8266
      • BeagleBone
      • 8051 Microcontroller
      • ARM
      • PIC Microcontroller
      • STM32
    • Tutorials
      • Audio Electronics
      • Battery Management
      • Brainwave
      • Electric Vehicles
      • EMI/EMC/RFI
      • Hardware Filters
      • IoT tutorials
      • Power Tutorials
      • Python
      • Sensors
      • USB
      • VHDL
    • Circuit Design
    • Project Videos
    • Components
  • Articles
    • Tech Articles
    • Insight
    • Invention Stories
    • How to
    • What Is
  • News
    • Electronic Product News
    • Business News
    • Company/Start-up News
    • DIY Reviews
    • Guest Post
  • Forums
    • EDABoard.com
    • Electro-Tech-Online
    • EG Forum Archive
  • DigiKey Store
    • Cables, Wires
    • Connectors, Interconnect
    • Discrete
    • Electromechanical
    • Embedded Computers
    • Enclosures, Hardware, Office
    • Integrated Circuits (ICs)
    • Isolators
    • LED/Optoelectronics
    • Passive
    • Power, Circuit Protection
    • Programmers
    • RF, Wireless
    • Semiconductors
    • Sensors, Transducers
    • Test Products
    • Tools
  • Learn
    • eBooks/Tech Tips
    • Design Guides
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Digital Issues
    • EE Training Days
    • LEAP Awards
    • Podcasts
    • Webinars / Digital Events
    • White Papers
    • Engineering Diversity & Inclusion
    • DesignFast
  • Guest Post Guidelines
  • Advertise
  • Subscribe

Xilinx expands UltraScale+ portfolio to include compact, intelligent edge solutions

By Michelle Froese April 13, 2021

Xilinx, Inc., a provider in adaptive computing, has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

As the world’s only hardware adaptable cost-optimized portfolio based on 16-nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC’s state-of-the-art Integrated Fan-Out (InFO) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

“Demand for compact, intelligent edge applications is driving the requirement for processing and bandwidth engines to not only provide higher performance, but also new levels of computing density to enable the smallest form factor systems,” said Sumit Shah, senior director, Product Line Management and Marketing at Xilinx. “The new cost-optimized additions to our UltraScale+ portfolio are powerful enhancements that leverage the architecture and production-proven technology of Xilinx’s UltraScale+ FPGAs and MPSoCs, which collectively have been deployed in millions of systems worldwide.”

Built for high I/O bandwidth & DSP compute
The Artix UltraScale+ family is built on its production-proven FPGA architecture and is ideal for a range of applications including machine vision with advanced sensor technology, high-speed networking, and ultra-compact “8K-ready” video broadcasting. Artix UltraScale+ devices deliver 16 gigabits-per-second transceivers to support emerging and advanced protocols in networking, vision, and video, while also delivering the highest DSP compute in its class.

Optimized for power & cost
Cost-optimized Zynq UltraScale+ MPSoCs include the new ZU1 and production-proven ZU2 and ZU3 devices, all available in InFO packaging. As part of the multiprocessing SoC line from the Zynq UltraScale+ family, ZU1 is designed for connectivity at the edge and industrial and healthcare IoT systems, including embedded vision cameras, AV-over-IP 4K, and 8K-ready streaming, hand-held test equipment, as well as consumer and medical applications.

The ZU1 is built for miniaturized compute-intensive applications and powered by a heterogeneous Arm® processor-based multicore processor subsystem, while also being able to migrate to common package footprints for greater compute.

“LUCID has worked closely with Xilinx to integrate the new UltraScale+ ZU3 into our next generation industrial machine vision camera, the Triton Edge,” said Rod Barman, founder, and president at LUCID Vision Labs. “With the UltraScale+ ZU3 and its InFO packaging, LUCID was able to utilize an innovative rigid-flex board architecture to squeeze an amazing amount of processing power into an ultra-compact IP67, factory-tough camera.”

Scalable & secure
With the addition of Artix devices and the extension to the Zynq UltraScale+ family, Xilinx’s portfolio now spans across the high-end with Virtex UltraScale+, to the midrange with Kintex UltraScale+, to the new cost-optimized low-end. These new devices round out the portfolio and provide scalability for customers to develop multiple solutions using the same Xilinx platform. This preserves design investments across the portfolio and speeds time-to-market.

Security is a critical component in Xilinx designs, and both cost-optimized Artix and Zynq UltraScale+ families include the same robust security features found across the UltraScale+ portfolio. Included are RSA-4096 authentication, AES-CGM decryption, DPA countermeasures, and Xilinx’s proprietary Security Monitor IP that adapts to security threats across the product lifecycle, meeting the security needs for defense and commercial projects.

“The ability for customers to scale their designs using a single secure platform for a wide range of applications and markets is key to enabling faster, easier design integration as well as for capturing critical time-to-market opportunities,” said Dan Mandell, senior analyst, IoT, and Embedded Technology at VDC Research. “Xilinx’s strategy to expand its portfolio to meet these market needs with its scalable and secure UltraScale+ Artix and Zynq families is compelling, especially considering the strong business opportunities in growth markets where these solutions are being deployed.”


Filed Under: Components, News
Tagged With: xilinx
 

Next Article

← Previous Article
Next Article →

Questions related to this article?
👉Ask and discuss on Electro-Tech-Online.com and EDAboard.com forums.



Tell Us What You Think!! Cancel reply

You must be logged in to post a comment.

EE TECH TOOLBOX

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE Learning Center

EE Learning Center
“engineers
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

HAVE A QUESTION?

Have a technical question about an article or other engineering questions? Check out our engineering forums EDABoard.com and Electro-Tech-Online.com where you can get those questions asked and answered by your peers!


RSS EDABOARD.com Discussions

  • Industrial Relay Board Design for Motorcycle Use
  • BF999 Input and output impedance
  • Control for DC motor
  • Sendust vs Ferrite for SMPS
  • On/Off Slide Switch Reassembly Help

RSS Electro-Tech-Online.com Discussions

  • Wierd makita battery
  • More fun with ws2812 this time XC8 and CLC
  • I Wanna build a robot
  • using a RTC in SF basic
  • Is AI making embedded software developers more productive?

Featured – LoRa/LoRaWan Series

  • What is the LoRaWAN network and how does it work?
  • Understanding LoRa architecture: nodes, gateways, and servers
  • Revolutionizing RF: LoRa applications and advantages
  • How to build a LoRa gateway using Raspberry Pi
  • How LoRa enables long-range communication
  • How communication works between two LoRa end-node devices

Recent Articles

  • The top five AI startups to watch in 2025
  • STMicroelectronics unveils SoC based on secure MCU
  • Nexperia’s 48 V ESD diodes support higher data rates with ultra-low capacitance design
  • Taoglas releases Patriot antenna with 18 integrated elements covering 600 to 6000 MHz
  • Amphenol RF introduces SMPM to SMPM assemblies on RG-178 cable

EE ENGINEERING TRAINING DAYS

engineering

Submit a Guest Post

submit a guest post
Engineers Garage
  • Analog IC TIps
  • Connector Tips
  • Battery Power Tips
  • DesignFast
  • EDABoard Forums
  • EE World Online
  • Electro-Tech-Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips
  • 5G Technology World
  • Subscribe to our newsletter
  • About Us
  • Contact Us
  • Advertise

Copyright © 2025 WTWH Media LLC. All Rights Reserved. The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media
Privacy Policy

Search Engineers Garage

  • Electronic Projects & Tutorials
    • Electronic Projects
      • Arduino Projects
      • AVR
      • Raspberry pi
      • ESP8266
      • BeagleBone
      • 8051 Microcontroller
      • ARM
      • PIC Microcontroller
      • STM32
    • Tutorials
      • Audio Electronics
      • Battery Management
      • Brainwave
      • Electric Vehicles
      • EMI/EMC/RFI
      • Hardware Filters
      • IoT tutorials
      • Power Tutorials
      • Python
      • Sensors
      • USB
      • VHDL
    • Circuit Design
    • Project Videos
    • Components
  • Articles
    • Tech Articles
    • Insight
    • Invention Stories
    • How to
    • What Is
  • News
    • Electronic Product News
    • Business News
    • Company/Start-up News
    • DIY Reviews
    • Guest Post
  • Forums
    • EDABoard.com
    • Electro-Tech-Online
    • EG Forum Archive
  • DigiKey Store
    • Cables, Wires
    • Connectors, Interconnect
    • Discrete
    • Electromechanical
    • Embedded Computers
    • Enclosures, Hardware, Office
    • Integrated Circuits (ICs)
    • Isolators
    • LED/Optoelectronics
    • Passive
    • Power, Circuit Protection
    • Programmers
    • RF, Wireless
    • Semiconductors
    • Sensors, Transducers
    • Test Products
    • Tools
  • Learn
    • eBooks/Tech Tips
    • Design Guides
    • Learning Center
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Digital Issues
    • EE Training Days
    • LEAP Awards
    • Podcasts
    • Webinars / Digital Events
    • White Papers
    • Engineering Diversity & Inclusion
    • DesignFast
  • Guest Post Guidelines
  • Advertise
  • Subscribe