CUI Introduces new Heat Sink Product Line to Further Expand Thermal Management Portfolio

CUI’s Thermal Management Group has announced to expand its existing portfolio of Peltier devices and dc fans by adding a heat sink product line. The new line of aluminum heat sinks is available in both extruded and stamped versions.

 

The range is compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages. These have been designed to improve the heat dissipation of low and high power board level applications. These stampings and extrusions are conveniently measured under 4 conditions for thermal resistance. This facilitates an easy selection of the optimal heat sink for natural convection or forced air cooling systems. 

 

The heat sinks offer tin plated or black anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W. The power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection.

 

 

Apart from the standard form factors and sizes, CUI also offers a wide range of custom heat sink capabilities. With alternate production methods like forging and die casting as well as extrusions and stampings, CUI can create virtually any shape or profile to meet specific design needs. Besides, a variety of additional materials and finishes are also available, including clear and color anodization, chromate powder coating, and nickel or zinc plating.

 

The standard or custom heat sinks can also be integrated with any of the current Peltier and DC fan offerings by the brand so as to achieve more complex thermal solutions. The entire product line is available at $0.17 per unit at 1000 pieces through distribution.

 

“At CUI, we see the development and expansion of our thermal management product line as a natural complement to our industry-leading portfolio of power products,” stated Kraig Kawada, CUI’s VP of Product Management. “As the heat in applications continues to rise due to increasing power densities, we believe that the introduction of these heat sinks, along with our current Peltier devices and dc fans will assist our customers in meeting their growing thermal management challenges.”