Samtec, Inc. has released the AcceleRate® mP (UDM6, UDF6) 10 mm stack height connector, which combines signal pins and power blades in one footprint to support dense routing in datacom, 5G/6G wireless networks, industrial automation, robotics, military and aerospace and instrumentation. The design supports up to 15 A per blade, 200 VAC or 283 VDC and 64 Gbps PAM4 (32 Gbps NRZ), with SET certification for rugged applications including LEO satellites, SmallSats and CubeSats.
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Filed Under: Applications, Connectors, Networking, News





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