Designing systems for the intelligent edge has never been more difficult. Market windows are shrinking, the costs and risks of new designs are rising, thermal constraints and reliability are twin priorities, and the need for cradle-to-grave security continues to grow.
Satisfying these simultaneous demands requires immediate knowledge of special technology and vertical-market expertise. There’s no time to start from scratch.
Today, Microchip Technology adds nine new technology- and application-specific solution stacks to its growing collection of mid-range FPGA and System-on-Chip (SoC) support. The stacks span the industrial edge, smart embedded vision, and edge communications.
“We’re making it much easier to create industry-leading industrial and communications designs,” said Shakeel Peera, VP of strategy for Microchip’s FPGA business unit. “And our intelligent edge focus is getting significant traction with leading system designers because they get the full benefit of PolarFire FPGA’s unequalled power efficiency, security, and reliability.”
The news of Microchip’s expanded solution stack collections follows the June announcement of an industrial edge stack for OPC/UA (Open Platform Communications/Unified Architecture) and extensive resources to help customers switch to PolarFire FPGAs and SoCs.
“Size, weight, and power are extremely important considerations in designing a thermal imaging system,” said Federic Aubrun, CCO of Xenics, a pioneer in infrared imaging, with best-in-class products for short, mid, and long-wave IR imagers, cores, and cameras. “Microchip SmartFusion and PolarFire FPGAs provide the best balance between small form factor, power efficiency and processing resources within an extremely low power budget in our current and next-generation products.”
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