Infineon expands its CoolSiC portfolio

The increasing demand for high-power density is pushing developers to adopt 1500 V_DC link in their applications to increase the rated power-per-inverter and reduce system costs. However, 1500 V_DC-based systems also pose more challenges on the system design, such as fast switching at high DC voltage, which typically requires a multi-level topology.

This leads to a complicated design and a relatively high number of components.

To address this challenge, Infineon Technologies has introduced its expanded CoolSiC portfolio with high-voltage solutions to provide the foundation for next-generation photovoltaic, EV charging, and energy-storage systems.

The extended CoolSiC portfolio offers 2-kV ,silicon-carbide (SiC) MOSFETs, along with a 2kV SiC diode for applications up to 1500 V _DC. The new SiC MOSFET combines low-switching losses and high-blocking voltage in one device that can optimally meet the requirements of 1500 V_DC systems.

The new 2-kV CoolSiC technology offers a low drain-source on resistance (R _DS(on)) value. In addition, the rugged body diode is suitable for hard switching. The technology enables sufficient overvoltage margin and offers ten times lower FIT rate caused by cosmic ray, compared to 1700 V SiC MOSFETs. Furthermore, the extended gate voltage operating range makes the devices easy to use.

This new SiC MOSFET chip is based on Infineon’s advanced SiC MOSFET technology named M1H which has recently been introduced. The latest advancements enable a significantly larger gate voltage window that improves the on-resistance for a given die size.

Simultaneously, the larger gate voltage window provides a high robustness against driver- and layout-related voltage peaks at the gate, without any restrictions even at high switching frequencies. Infineon offers a range of EiceDRIVER gate drivers with functional isolation of up to 2.3 kV to support the 2-kV SiC MOSFETs.