MediaTek has announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm…
STMicroelectronics and MACOM announce successful RF GaN-on-Si prototypes
STMicroelectronics, a global semiconductor provider, and MACOM Technology Solutions Holdings, a supplier of semiconductor products for the telecommunications, industrial, defense, and datacenter industries, have announced the successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes. With this achievement, ST and MACOM will continue to work together and enhance our relationship. RF GaN-on-Silicon offers high potential for…
STMicroelectronics launches new MDmesh MOSFETs
STMicroelectronics’ STPOWER MDmesh M9 and DM9 N-channel super-junction, multi-drain, silicon-power MOSFETs are ideal for switched-mode power supplies (SMPS) in applications from data-center servers and 5G infrastructure to flat-panel televisions. The first devices to be launched are the 650V STP65N045M9 and the 600V STP60N043DM9. Both have low on-resistance (RDS(on)) per unit area, which maximizes power density and permits compact system dimensions. Each has…
New semiconductor collaboration to advance next-generation FD-SOI roadmap
CEA, Soitec, GlobalFoundries, and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI (fully depleted silicon-on-insulator) technology. “ST was an early innovator in FD-SOI and has been in production for several years, with both custom and standard advanced products for a broad range of end-markets,”…
MediaTek launches Dimensity 8000 5G chip series for 5G smartphones
MediaTek has launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology — connectivity, displays, gaming, as well as multimedia and imaging features — to premium 5G smartphones. Both chips borrow the advanced technology from MediaTek’s powerful flagship Dimensity 9000 platform and package it into the new Dimensity 8000 series which…
New Snapdragon X70 Modem-RF offers world’s first 5G AI processor
Qualcomm Technologies has announced the Snapdragon X70 5G Modem-RF System, its 5th generation modem-to-antenna 5G solution. Snapdragon X70 introduces the world’s first 5G AI processor in a modem-RF system, to harness the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads — offering fast upload speeds, low latency, coverage, and power efficiency.…
Qualcomm collaborates to advance smart cities and 5G IoT solutions
Qualcomm Technologies is collaborating with Cybertrust Japan Co. and SB Technology Corp. to support the deployment of smart solutions through the Qualcomm IoT Services Suite so as to better help businesses and entities looking to adopt and integrate smart solutions. This will first begin in Japan, with intent to expand globally in the future. Through…
Samsung offers advanced Exynos 2200 mobile processor with Xclipse GPU
Samsung Electronics, a provider of advanced semiconductor technology, has announced its new premium mobile processor, the Exynos 2200. The Exynos 2200 is a freshly designed mobile processor with a powerful AMD RDNA 2 architecture based Samsung Xclipse graphics processing unit (GPU). With the most cutting-edge Arm-based CPU cores available in the market today and an…
Qualcomm and its partners offer first smartphone demo of iSIM technology
Qualcomm Technologies, Vodafone, and Thales have joined forces to demonstrate a working smartphone, featuring iSIM (based on the ieUICC GSMA specification), a new technology enabling the functionality of a SIM card to be integrated into a device’s main processor. This milestone paves the way for commercialization of the technology, which could be rolled out in…
ADI launches first RadioVerse SoC for 5G radio designers
Analog Devices, Inc. (ADI) has announced a breakthrough RadioVerse System-on-Chip (SoC) series, providing radio-unit (RU) developers with an agile and cost-effective platform to create the most energy efficient 5G RUs in the industry. The new SoC series provides advanced RF signal processing with expanded digital functionality and RF capacity that greatly improves 5G RU performance…
Highest uplink peak rate recorded on a commercial network achieved using 5G
Ericsson, Telstra, and Qualcomm Technologies have achieved the highest uplink peak rate ever recorded on a commercial network during a live demo in Queensland, Australia. Together, they reached an uplink data speed of close to 1Gbps, paving the way for more seamless experiences in use cases, such as live video streaming and social media content…
Renesas releases new ClockMatrix Family of network synchronizers and jitter attenuators
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has introduced the ClockMatrix 2 high-performance, precision, multi-channel timing devices for 400/800Gbps optical transport and wireline network applications. Building on the ClockMatrix devices introduced in 2019 for 5G wireless and 100/200Gbps wireline network applications, the second-generation family delivers improved performance with phase jitter as low as 88fs-rms.…
Micron and MediaTek first to validate LPDDR5X 5G chipset for smartphone
MediaTek recently validated Micron Technology’s low-power, double data rate 5X (LPDDR5X) DRAM for MediaTek’s new Dimensity 9000 5G flagship chipset for smartphones. Micron is the first semiconductor company to sample and validate this fastest, most advanced mobile memory in the industry and has shipped the first batch of samples of LPDDR5X built on its first-to-market…
Microchip expands its gallium-nitride RF power portfolio
Microchip Technology Inc. recently announced a significant expansion of its gallium-nitride (GaN), radio-frequency (RF). power-device portfolio with new MMICs and discrete transistors that cover frequencies up to 20 gigahertz (GHz). The devices combine high power-added efficiency (PAE) and high linearity to deliver new levels of performance in applications — ranging from 5G to electronic warfare, satellite communications, commercial…
Renesas releases its first dual-beam, active beamforming IC lineup
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, is expanding its portfolio of mmWave LNAs and Tx BFICs with the introduction of three new dual-beam active beamforming ICs: F6121 for Ku-band Satcom F6122 for Ka-band Satcom and F6123 for Ku-band radar and line-of-sight communications Featuring best-in-class power consumption, noise figure, a compact size, and…
Renesas expands its 5G mmWave beamformer portfolio
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, has expanded its 5G beamformer IC family with two dual-polarization mmWave devices, optimized for 2×2 antenna architecture for 5G and broadband wireless applications — with best-in-class performance at n257, n258, and 261 bands. The highly integrated F5288 and F5268 transmitter/receiver (8T8R) chipsets sit on a small…
Renesas offers temperature-grade, industrial DDR5 and DDR4 registered clock drivers
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, introduced the industry’s first industrial temperature DDR5 (5RCD0148H) and DDR4 (4RCD0232K) registered clock drivers (RCDs). The new devices are targeted at demanding applications such as edge computing, automotive vehicles, industry 4.0, and 5G applications. The new industrial temp RCDs support temperatures as low as -40° C…
Microchip and Acacia partner to enable 400G pluggable coherent optics for data centers
Bandwidth growth, driven by the expansion of data centers and 5G network build-outs, is expected to drive the need for faster coherent Dense Wavelength Division Multiplexing (DWDM) pluggable optics. Consequently, Data Center Interconnect (DCI) and metro Optical Transport Network (OTN) platforms are transitioning from 100/200G to 400G pluggable coherent optical modules to support these hyper-connected…
Samsung offers comprehensive VoN solution for 5G voice call service
Samsung Electronics announced that it has developed its comprehensive Voice over New Radio (VoNR) solution for 5G voice call service, available for global mobile device manufacturers and network providers. With the comprehensive solution for VoNR, the company can offer more streamlined SoC development and 5G VoNR service deployment. VoNR technology supports voice call and data…
New Qualcomm report calls for accelerated 5G technology and adoption
A new Qualcomm Technologies report, “Environmental sustainability and a greener economy: The transformative role of 5G,” highlights the many ways 5G technology can achieve critically needed sustainability benefits and calls for joint efforts by industry and government to accelerate 5G adoption. The report finds that 5G can transform and positively impact industries across the globe…