In the previous article, we presented a resistor selection reference table. With the help of this table, you can determine which type of resistor will be most suitable for a given circuit or application. Once you’ve determined which type of resistor suits the best, it’s time to pick up the desired resistor. For that, it…
Microsemi Corporation, a leading provider of semiconductor solutions, and Tamba Networks, a leading developer of connectivity intellectual property (IP) cores, have announced their collaboration. Under this, Tamba Network’s Ethernet media access controller (MAC) will be incorporated to Microsemi’s cost-optimized, low-power PolarFire field programmable gate array (FPGA) to offer industry-leading low power FPGA-based 10G Ethernet solution. Microsemi used the company’s Interlaken and 10G/40G Ethernet MAC soft cores as key building blocks to evaluate and enhance PolarFire FPGAs’ fabric architecture, with 10G and 40G data paths running at 160 MHz and 320 MHz. These cores offer extremely low gate count and latency, with high flexibility.
Marvell, a leading provider of semiconductor solutions, has announced the 88W8987xA. It’s the industry’s first automotive-grade system-on-chip (SoC) to be integrated with the latest Wi-Fi, Bluetooth, and vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) capabilities. This sophisticated wireless combo chip brings the industry-best solution for in-car Wi-Fi, Bluetooth 5, and 802.11p. The modern connected cars have a need for reliable and high-performance wireless connectivity. Elements like secure telematics, in-car wireless gateways, in-vehicle infotainment, and enhanced safety features are continually increasing costs and complexity across every automotive segment.
Renesas Electronics, a premier supplier of advanced semiconductor solutions, has announced its new R9J02G012 USB Powder Delivery (USB PD) controller. It’s intended to be used in a wide range of USB PD products employing direct current (DC) power including AC adapters, PCs, smartphones, other office and consumer equipment, toys, etc. R9J02G012 is the industry’s first single package solution (Note 1) that supports both USB Power Delivery Rev. 3.0 (USB PD 3.0) and USB Type-C Authentication Rev 1.0, which allows device-to-device authentication.The growing demand for fast charging mobile devices is driving increased demand for high DC power delivery (e.g. 100 W). Earlier, system manufacturers used to implement proprietary fast-charging methods using USB Micro-B connectors.
Microsemi Corporation, a leading provider of semiconductor solutions and Analog Devices, Inc., the leading global high-performance analog technology company; have together introduced a scalable Silicon (SiC) driver reference design solution. The solution is based on a range of Microsemi SiC MOSFET products and Analog Device’s ADuM4135 5KV isolated gate driver. This reference design offer user-friendly design guides rendering faster time to market and support the transition to Microsemi’s next-generation SiC MOSFETs. The design also allows customers with a highly isolated SiC MOSFET dual-gate driver switch as a means for evaluation of SiC MOSFETs in a number of topologies. It includes modes optimized for half-bridge switching with synchronous dead time protection and asynchronous signal transfer with no protection.
CUI’s Power Group has officially announced the addition of 300 W series to its lineup of internal AC-DC medical power supplies. The VMS-300A Series available in industry standard 3” x 5” open frame and metal enclosed packages offer an efficiency of up to 94% as well as high power densities of up to 14.5 W/in3. The new series complies with the EN 60601-1 edition 3.1 safety standards as well as 4th edition EMC requirements. These single output medical power supplies have been designed for energy-conscious, 2 x MPOO (Means of Patient Protection) hospital, home healthcare, and dental applications.
Texas Instruments has introduced a new millimeter wave (mmWave) single-chip complementary metal-oxide semiconductor (CMOS) portfolio. With this release, the company has brought an unprecedented degree of precision and intelligence to a wide variety of applications spanning the automotive, factory, and building automation, and medical markets. The range includes 5 solutions across 2 families of 76- to 81-GHz sensors with a complete end-to-end development platform. The AWR1x and IWR1x sensor portfolio delivers up to 3 times more accurate sensing than the existing mmWave solutions on the market. This blend of sophisticated analog design techniques with digital signal processing enables designers to implement intelligent and contactless sensing in their systems.
ON Semiconductor, a leading supplier of semiconductor-based solutions, has introduced an advanced synchronous rectifier (SR) controller optimised for LLC resonant converter topologies. The FAN6248 needs minimal additional components, delivers high efficiency, eases thermal management, simplifies the LLC power supplies design and improves the overall system reliability. This controller is an ideal solution for modern, high-performance, power supply units (PSU) requiring high levels of reliability and efficiency in a small space. Some of the typical applications include gaming, server and desktop computing, LCD and OLED TV, LED lighting, telecom, and networking.
Intersil, a subsidiary of Renesas Electronics Corporation, has introduced a highly integrated programmable power management IC (PMIC). It delivers 91% efficiency at 1.1 V output voltage for application processors, GPUs, FPGAs, and high-performance system power.The new PMIC carries low RDS (on) MOSFETs and programmable PWM frequency which allow designers to use fewer low-profile external components, enabling a 50mm2 power-supply that is 40% smaller than competing solutions. The ISL91211 triple/quad output PMIC is ideal for smartphones, tablet computers, solid-state drives, networking and wireless Internet of Things (IoT) devices powered by single-cell Lithium-ion (Li-on) batteries, or 2.5V – 5.5V power supplies.
NVIDIA has officially launched the world’s most powerful GPU computing architecture named Volta. It has been created to drive the next wave of advancement in AI and high-performance computing. Besides, the company has also unveiled its first Volta-based processor- the NVIDIA Tesla V100 data center GPU.It delivers extraordinary speed and scalability for AI inferencing and training along with accelerated HPC and graphics workloads. Volta is NVIDIA’s 7th generation GPU architecture and is built with 21 billion transistors. Its performance is equivalent to 100 CPUs for deep learning.
4D Systems has announced the release of the modules-on-the-go (MOTG) Series offering a simple plug-and-play interface to the 4D systems gen4 range of DIABL016 and PICASO intelligent display modules. In order to meet the demand for additional display modules interface and communication capabilities, the MOTG Series has been specifically designed to cater to the customer needs. To offer this connectivity, the company has developed the Universal MOTG Interface (UMI), published as an open standard. Initially, the series would include 4 modules offering Wi-Fi, Bluetooth (BLE), RS232 or RS485 connectivity. These modules are plugged into an interface board that also links to either a gen4 DIABL016 or PICASO display. The fifth module would add MP3 playback functionality.
Alliance Memory has unveiled a new 1 Gb high-speed CMOS double data rate synchronous DRAM in the 66-pin TSOP II package. The AS4C128M8D1-6TIN operates in the industrial temperature range of -40°C to +85°C and carries a rare internal configuration of 4 banks of 32M word x bits. It also features a clock frequency of up to 166 MHz for fast data transfer rates, reliable drop-in and pin-to-pin compatible replacement for a number of solutions. It’s ideally suited for industrial, medical, communications and military solutions involving high memory bandwidth. Further, the SDRAM operates from a single +2.5V (±0.2V) power supply, equipped with a power-down mode to lower power consumption, and offers a data mask for write control.
Microchip Technology Inc. has recently introduced the SAM R30 System in Package (SiP) that incorporates a single-chip ultra-low power RF microcontroller along with an 802.15.4 sub-GHz radio. It’s a compact 5 mm package with a multi-year battery life, design flexibility, and proven reliability. This makes it ideal for connected home, smart city, and other industrial applications. In the present situation, when demand for battery-powered wireless systems is huge, the Sam R30 package meets the power-conscious demands of the market by offering extended battery life. The SiP is built using the SAM L21 MCU leveraging the Cortex® M0+ architecture, the most energy-efficient ARM®-based architecture available.
CUI’s Power Group has made the announcement to expand the VOF ac-dc power supply family by launching a compact 300 W Series. The VOF-300 Series has been rolled out in an open frame and metal enclosed packages. It’s a higher power addition to the brand’s existing general purpose ac-dc power supply portfolio available across a wide range of 6 W to 280 W. Apart from delivering an ideal mix of economy and power, the single output power supply series delivers efficiencies up to 94% and no-load power consumption as low as 0.3 W for energy-conscious ITE, industrial, and consumer electronics applications.
Congatec, a leading supplier of embedded computer modules and single board computers, has officially released the COM Express 3.0 specification. This specification formally integrates the new Type 7 pinout type, the basis for the brand’s Server-on-Modules. The official release of the new specification marks the beginning of a race to a new generation of server designs that are based on the standardized Server-on-Modules. The new products offer the most cost-effective designs and upgrades across all the existing as well as forthcoming generations of server class processors and sockets, irrespective of the vendor.
Alliance Memory, a worldwide provider of LEGACY memory products, has launched a new line of high-speed CMOS mobile low power DDR2 (LPDDR2) SDRAMs. These devices have been released with densities of 1Gb, 2Gb, and 4Gb in the 134-ball package. A wide variety of power saving features is also available with the new offering like 1.2 V/1.8 V operating voltages, improved battery life in portable electronics, and high density enabling ultra-slim designs. The new LPDDR2 SDRAMs offer reliable drop-in, pin-to-pin compatible replacements for a number of similar solutions in ultra-low-voltage cores and I/O power supplies for mobile devices like smartphones, tablets, etc. The ICs are available with auto temperature-compensated self-refresh (TCSR) to ensure minimal power consumption at lower ambient temperatures.
B&K Precision, a leading designer and manufacturer of reliable and cost-effective test and measurement instruments, has released the latest multi-range DC power supplies. The models 9103 and 9104 operate in constant voltage (CV) or constant current (CC) mode and deliver up to 320 W in any combination of its rated voltage and current – 42 V/20 A (model 9103) and 84 V/10 A (model 9104). Owing to the lightweight and compact form factor, these models can replace multiple power supplies on a bench thus giving way to a wide array of applications including manufacturing, service and repair, engineering, and education. Unlike the conventional power supplies, these offer greater flexibility by extending the operating range beyond a single maximum power point.
Microsemi Corporation, a leading provider of semiconductor solutions, has released its latest version of Libero system-on-chip (SoC) software version 11.8. It’s a comprehensive suite of field programmable gate array (FPGA) design tools and includes important enhancements in the form of mixed language simulation, a new netlist viewer, and best-in-class debugging capabilities. Apart from the software, the company has also come up with a 60-day free evaluation license allowing users to evaluate Microsemi’s flash-based FPGAs and SoC FPGAs. The SoC tool suite includes the Mentor Graphics ModelSim Simulator foe line by line verification of the hardware description language (HDL) code.
IBASE, a leading provider of embedded board and industrial computer solutions, has introduced ET970 COM Express CPU module that supports the 7th generation Intel Core SoC processors, codenamed Kaby Lake. Discussing the details, the ET970 is built around the Intel CM238/QM175 chipset. It boosts the I/O performance to match the benefits of the latest mobile Intel Core processors, built through the optimised 14-nm manufacturing process. Dimensionally, it’s 95 mm x 125 mm and is equipped with an optional heat spreader. IBASE has rolled out the compact ET970 COM Express modules in three versions with processors specifically including the Intel® Core™ i7 7820EQ (3.0GHz~3.5GHz), the Intel® Core™ i5 7440EQ (2.9GHz~3.6GHz) and the Intel® Core™ i3 7100E (2.9GHz).
Renesas Electronics Corporation has unveiled the new 100 kW class inverter solution that achieves industry-leading small design class of 3.9 liter (L) for high power 100 kW class motors in mid-to-large-sized hybrid electric vehicles (HEVs) including SUVs, and mid-to-small-sized electric vehicles (EVs). The new offering is going to be offered as a solution kit including software that maximizes the HEV/EV motor performance and hardware components like microcontrollers, Insulated Gate Bipolar Transistor (IGBT), fast recovery diode (FRD), and other semiconductor devices. The solution would enable developers to cut down various development steps ranging from specifications analysis to hardware/software development and motor characteristics adjustments.